New Technology Release Conference


Date: Thursday, March 27, 2025
Time: 10:00-16:30
Venue: M42, Hall N2, Shanghai New International Expo Centre

Attendee Registration   Previous Review

SEMI and ABKS have collaborated to host a prestigious New Technology Release Conference during SEMICON China 2025 on Mar. 27th 2025. This event stands as a brilliant showcase of the latest advancements in semiconductor technology and provides profound insights into the future trajectory of the industry.

The event will feature a range of disruptive technologies and innovative solutions, encompassing advanced manufacturing processes, high-performance chip designs, intelligent production equipment, and sustainable materials science. Each new technology presented will serve as a powerful interpretation of the future direction of the semiconductor industry.

For attendees, this is not only an excellent opportunity for learning, exchange, and broadening horizons but also a premium platform for showcasing corporate technical prowess and enhancing brand image. Through the SEMICON China stage, your company can demonstrate its leadership in technological innovation to the global audience and establish valuable partnerships with peers from across the world, jointly driving the prosperity of the semiconductor industry.

Organizer:
 


Co-organizer:
 


SPONSORS
         
         
     
         

Agenda / 议程
   
10:20-10:30
Welcome Remark / 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
   
Moderator / 主持人
陈金龙
江苏雅克科技股份有限公司副总裁
SEMI中国材料委员会委员、国家集成电路材料产业技术创新联盟理事、复旦科技园集成电路融创中心（“复创芯”）联合创始人
   
10:30-10:55
Magnetic Levitation Technology Facilitates Semiconductor Clean Processes
磁悬浮技术为半导体洁净工艺保驾护航
Yin Cheng ke 尹成科 博士
President&General Manager&Founder，Suzhou Supermag Intelligent Technology Co.,Ltd.
董事长，总经理，创始人 苏州苏磁智能科技有限公司
   
10:55-11:15
Semiconductor Key Equipment Control System Localization Solution
半导体核心装备控制系统自主可控解决方案
Sunyuanhao 孙远浩
Deputy General Manager, Beijing Hollysys Intelligent Technologies Co., Ltd.
副总经理，北京和利时智能技术有限公司
   
11:15-11:35
High-performance Active Vibration Control Technology and Products for Semiconductor Equipment
面向半导体设备的高性能主动减振技术与产品
Wei Jiang 姜伟
Professor, Wuhan Glory Road Precision Technology Co.,Ltd.
教授，武汉格蓝若精密技术有限公司
   
11:35-11:55
Defect Inspection using UV/DUV light scattering for the advanced semiconductor fabrication
UV/DUV 散射光在先进半导体制造缺陷检测中的应用
Wang Di 王迪 博士
CTO, Jiangsu Semiinnovation Technology Co.,Ltd
首席技术官，江苏芯势科技有限公司
   
11:55-12:00 抽奖
   
14:00-14:20
Solutions for Semiconductor Industry——Shimadzu contributes to the high-quality development of the semiconductor industry
岛津助力半导体行业高质量发展——从材料到器件、从制造工序到不良解析提供全方位支持
Liu Zhou
Senior Expert of Analytical & Measuring Instruments Division，SHIMADZU(CHINA) CO. ,LTD.
分析测量仪器事业部高级专家，岛津企业管理(中国)有限公司
   
14:20-14:40
Innovative Applications of Metal 3D Printing Technology
金属3D打印技术的创新性应用
Yang Wanhu 杨湾湖
General Manager, Bright Laser Technologies (Shenzhen) Co., Ltd.
总经理，铂力特（深圳）增材制造有限公司
   
14:40-15:00
Mikoptik MSS-01: Lithography innovation driving the development of packaging substrate
源卓微纳MSS-01：光刻技术革新推动封装基板发展
高安
CTO, ADVANCED MICRO OPTICS.INC
CTO，源卓微纳科技（苏州）股份有限公司
   
15:00-15:20
Application of ultrafast lasers in packaging industry
超快激光器在半导体封装行业的应用
Chen Guodong 陈国栋
Director&Chief Engineer，Shenzhen Han's CNC Technology Co., LTD.
总监兼总工程师， 深圳市大族数控科技股份有限公司
   
15:20-15:40
Laser Solutions for Semiconductor Packaging Industry
半导体封装领域的激光应用
张子国
Director Suzhou Delphi Laser Co., Ltd.
工艺总监，苏州德龙激光股份有限公司
   
15:40-16:00
Honseal@FFKM-Semiconductor Precision Sealing Materials
Honseal@全氟醚橡胶-半导体精密密封材料
Zhao Rongming 赵荣朋
Technology Department Manager，Sichuan hongxin FFKM Technology Co., Ltd
技术部部长，四川弘芯氟醚科技有限公司
   
16:00-16:20
Introduction to ultra trace contamination detection technology of semiconductor
金奇梅
资深技术应用工程师，上海微纳精迅检测技术有限公司
   
16:20-16:30 抽奖
   
* Agenda is subject to change
* 会议议程更新中，以会议现场资料为准。
   

联系方式 / Contacts:
孙贤波 / Xianbo Sun
021-60278569
xsun@semi.org