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Dr. Tim Chen 陈田安 CEO, Darbond Technology Co.,Ltd. 烟台德邦科技总经理 |
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讲师简介 / Speaker Bio Chen Tian 'an, President of Yantai Darbond Technology Co., LTD., Doctor of organic polymer Chemistry from University of Nebraska-Lincoln, USA, national high-level overseas expert, expert member of the Advisory Committee of the National Integrated Circuit Material Industry Technology Innovation Strategic Alliance, director of the National Integrated Circuit packaging industry chain Technology Innovation Strategic Alliance and member of the expert Advisory Committee. He has been engaged in the research and development of electronic materials for a long time, and has more than 20 years of integrated circuit packaging technology development and management experience. He has scientific research achievements in polymer materials, nonlinear polymer optoelectronic materials, ultra-low dielectric materials for IC chips and other materials fields. He has published more than 50 scientific papers at home and abroad, and obtained more than 40 authorized patents in the United States and more than 100 authorized patents in China. 摘要 / Abstract 一. 半导体封装材料市场 1.1 全球半导体封装材料市场预测 1.2 市场规模增长的驱动展望 1.3 先进制造工艺介绍 二. 半导体封装材料发展现况 2.1 集成电路封装技术发展趋势 2.2 国内主要的半导体封装材料现况 三．德邦半导体封装材料解决方案 3.1 公司先进封装材料业务板块的布局 3.2 国内封装材料未来展望 |
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