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March 14-16,2018
Shanghai New International Expo Centre

Advanced Packaging Technology Forum 2014

SEMICON China - SESSIONS / EVENTS - Advanced Packaging Technology Forum


Concurrent Technology Forums

·More-than-Moore Technology Forum
·China Equipment Market Forum
·IC Applications from Design to Manufacturing Forum
·Advanced Packaging Technology Forum
·LED China Conference 2014
·Wearable Device Tech Forum
 

There are
00 days 00 hours 00 minutes 00 seconds
Date: Thursday, March 20, 2014
Time:13:00-17:00
Venue: Pudong Ball room 2+3, Kerry Hotel, Pudong, Shanghai
Language:   English


   
     
 
       



Nowadays, electronic products, Smart Phone, tablets, wearable device, are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the device node according to Moore’s Law. However, as the scale of the device node shrinks, Moore’s Law has reached its limit. Advanced Packaging Integration is alternative way to drive performance. 

In conjunction with SEMICON China 2014, SEMI China will organize Advanced Packaging Technology Forum, which will discuss the solution of Advanced Packaging, including 2.5D/3D packaging, WLP, Cu Pillar, High density TSV technologies, and analyze the market trend of these technologies. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.



Market Analysis of Advanced Packaging
Approaches Overview of Advanced Packaging Technologies
New Materials in Advanced Packaging Integration
Testing of Advanced Packaging Integration
Modeling of Advanced Packaging Integration
Roadmap Discussion of Advanced Packaging in China
Challenges of Advanced Packaging Development in China



Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service


Oral Presentation Materials :
SCC 2014 PPT Template



 
Moderator  
1

Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

   
13:00 - 13:10 Opening Remark
Tom Salmon
Vice President, Global Member Services & Standards, SEMI
   
13:10 – 13:40 The evolvement of IC & packaging
1 Dr. Ed Chang
Director, China Business Development, TSMC
   
13:40 – 14:10 3D Integration Opportunities and Plating Challenges
1 Dr. Zhenqiu Liu
Director of Wet Process Engineering, TEL, USA
   
14:10 – 14:40 New Opportunity of Advanced Packaging Process Equipment
1 Peijun Ding
Vice president, Beijing NMC Co.,Ltd.
   
14:40 – 15:10 Advanced CSP & Turnkey Solutions
1 Fumio Ohyama
Deputy Chief Sales Officer, Tera Probe


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15:10 – 15:40 Innovative Advanced Package Solutions for Mobile Application
1 Chang-Yi (Albert) Lan
Senior Director, SPIL


 
   
15:40 – 16:10 3D-IC beyond smartphones
1 Gregory Smith
VP of Teradyne, Computing & Communications Business Unit
Teradyne


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16:10 – 16:40 Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices
1 Rolf Aschenbrenner
IEEE Fellow / Deputy Director, Fraunhofer IZM,


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16:40 -16:50 Closing and lucky draw (Huawei P6S Smart Phone)




Mr. JY Zhang
Tel: 86-21-60278556
Email: jyzhang@semi.org

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: stacy.zhang@semi.org.cn