Concurrent Technology Forums
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Time:13:00-17:00
Venue: Pudong Ball room 2+3, Kerry Hotel, Pudong, Shanghai
Language: English
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Nowadays, electronic products, Smart Phone, tablets, wearable device, are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the device node according to Moore’s Law. However, as the scale of the device node shrinks, Moore’s Law has reached its limit. Advanced Packaging Integration is alternative way to drive performance.
In conjunction with SEMICON China 2014, SEMI China will organize Advanced Packaging Technology Forum, which will discuss the solution of Advanced Packaging, including 2.5D/3D packaging, WLP, Cu Pillar, High density TSV technologies, and analyze the market trend of these technologies. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.
Market Analysis of Advanced PackagingApproaches Overview of Advanced Packaging TechnologiesNew Materials in Advanced Packaging IntegrationTesting of Advanced Packaging IntegrationModeling of Advanced Packaging IntegrationRoadmap Discussion of Advanced Packaging in ChinaChallenges of Advanced Packaging Development in China
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service
Oral Presentation Materials ：
SCC 2014 PPT Template
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| Moderator | |
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| 13:00 - 13:10 | Opening Remark |
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Tom Salmon Vice President, Global Member Services & Standards, SEMI |
| 13:10 – 13:40 | The evolvement of IC & packaging |
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Dr. Ed Chang Director, China Business Development, TSMC |
| 13:40 – 14:10 | 3D Integration Opportunities and Plating Challenges |
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Dr. Zhenqiu Liu Director of Wet Process Engineering, TEL, USA |
| 14:10 – 14:40 | New Opportunity of Advanced Packaging Process Equipment |
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Peijun Ding Vice president, Beijing NMC Co.,Ltd. |
| 14:40 – 15:10 | Advanced CSP & Turnkey Solutions |
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Fumio Ohyama Deputy Chief Sales Officer, Tera Probe Download |
| 15:10 – 15:40 | Innovative Advanced Package Solutions for Mobile Application |
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Chang-Yi (Albert) Lan Senior Director, SPIL |
| 15:40 – 16:10 | 3D-IC beyond smartphones |
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Gregory Smith VP of Teradyne, Computing & Communications Business Unit Teradyne Download |
| 16:10 – 16:40 | Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices |
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Rolf Aschenbrenner IEEE Fellow / Deputy Director, Fraunhofer IZM, Download |
| 16:40 -16:50 | Closing and lucky draw (Huawei P6S Smart Phone) |
Mr. JY Zhang
Tel: 86-21-60278556
Email: [email protected]
Ms. Stacy Zhang
Tel: 86-21-60278552
Email: [email protected]