| Date: | Monday, March 12, 2018 |
| Venue: | Shanghai International Convention Center |
| Room: | 5H |
14:30–16:00
|
IC Packaging Technology Development – Current Status and Trend Dr. Yifan Guo Vice President of Engineering, ASE Shanghai Introduction of IC Technologies and Applications • Principle of IC Packaging • Design and Process in Advanced IC Packaging Technology • Future Trend in IC Packaging Technology Development |
16:00–17:30
|
IC Packaging Reliability Alex Xu Deputy General Manager of Quality Test Center, Jiangsu Changjiang Electronics Technology Co., Ltd (JCET) |
