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March 14-16,2018
Shanghai New International Expo Centre

Course 2: Advanced IC Packaging and Reliability

Date: Monday, March 12, 2018
Venue: Shanghai International Convention Center
   
14:30–16:00
IC Packaging Technology Development – Current Status and Trend
Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

Introduction of IC Technologies and Applications
• Principle of IC Packaging
• Design and Process in Advanced IC Packaging Technology
• Future Trend in IC Packaging Technology Development
   
16:00–17:30
IC Packaging Reliability
Alex Xu
Deputy General Manager of Quality Test Center, Jiangsu Changjiang Electronics Technology Co., Ltd (JCET)


Course 1   Agenda