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March 20-22, 2019
Shanghai New International Expo Centre

Tutorial 1: Devices, process integration, key modules and defects reduction for a manufacturable 14nm to 10nm CMOS technology

Date: Monday, March 12, 2018
Venue: Shanghai International Convention Center
Room: 5F
   

14:30-15:30

CMOS Technology Challenges and Opportunities for FINFET and Beyond
Dr. Dechao Guo
Sr. Manager, IBM
   

15:30-16:30

BEOL Interconnect Technology: Scaling Trends and Opportunities
Dr. Griselda Bonilla
Sr. Manager, IBM
   
16:30-17:30


Defect characteristics and yield control for 14nm to 10nm CMOS technology
Dr. Kan Chen
Sr. Manager, KLA Tencor


Tutorial 2   会议议程