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Mario Morales Group VP, IDC Semiconductors and Enabling Technologies IDC 全球半导体与赋能科技研究集团总裁 |
讲师简介 / Speaker Bio Mario Morales is the group vice president of IDC's enabling technologies, semiconductor, and storage research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors. BACKGROUND Mr. Morales is an accomplished program vice president, manager, and industry expert with over 30+ years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC's largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs. Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, UMC, SoftBank, ARM, NXP, and others. Over his career, Mr. Morales has authored and co-authored over 250 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage, memory, sensors, and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, AI ML architectures, cellular baseband modems, WiFi, cellular broadband, digital consumer, foundry, EMS, and intelligent systems. His career includes past positions with NEC Electronics and Dataquest. EDUCATIONAL ACCOMPLISHMENTS • B.S. in Finance and Accounting from San Jose State University • Fluent in English and Spanish • Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients • Strong reputation as an advisor and industry expert on Wall Street • IDC executive analyst for Intel and Qualcomm • Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industry conferences including ISS, GSA, CASPA, CISES, and SEMI 摘要 / Abstract 1.AI加速器路线图,为在边缘侧和端侧推理扩展提供了下一个机会。 2.空间计算支持下一个UI和用户体验。 3.实时节能计算解决方案:SoC、MCU和较小的语言模型,共同推动人工智能的下一阶段发展。 4.未来3-5年,高带宽内存和接口技术在下一代系统中是否会保持强劲增长? 5.半导体行业销售额会比预期提前达到1万亿美元吗? 6.美国和欧盟的《芯片法案》是否推动创新并改变了竞争格局? |