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March 20-22, 2019
Shanghai New International Expo Centre

Symposium VI: Metrology, Reliability and Testing



Symposium VI: Metrology, Reliability and Testing

Symposium Committee

Dr. Peilin SONG
Chair
IBM, USA
   
Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA
   
Dr. Frank Feng
Member
Mentor Graphics Corporation,USA
   
Dr. Yiping Xu
Member
Raintree Technologies Corp, China
   
Dr. Yuhua CHENG
Member
Peking University, China
   
Dr. Francis JEN
Member
KLA Tencor, China
   
Dr. Kelvin XIA
Member
Advantest, China
   
Dr. Srinivas RAGHVENDRA
Member
Synopsys, USA
Dr. Xiaowei Li
Member
IME, CAS, China
   
Dr. Yu Huang
Member
Mentor Graphics, USA
   
Dr. Jian-fu Zhang
Member
Liverpool John Moores University
   
Dr. Houken Tseng
Member
Teradyne, Taiwan, China
   
Dr. Yu Zhu
Member
TSMC, Taiwan, China
   
Dr. Ye Feng
Member
Lam Research, USA
   

Symposium VI: Metrology, Reliability and Testing

•   Metrology
   Applications to ICs, thin film heads, systems-on-a-chip, and thin film
   Device manufacturing
   Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy
   Critical dimension metrologies
   Defect detection, analysis, and control
   Limits of metrology and inspection systems
   Mask related metrology
   Measurement system modeling and simulation
   Metrology and inspection methodologies
   Overlay, registration, and alignment metrologies
   Process control, characterization, and yield enhancement

•   Reliability
   3D IC reliability
   Back-End Reliability
   Front-End Reliability
   Memory
   MEMS reliability
   Middle of Line Reliability
   Nano-electronic device reliability
   Package/assembly reliability
   Product reliability and burn-in
   Reliability in designs and circuits
   Reliability in device and process
   Reliability in interconnects
   Reliability qualification strategies

•   Test
   2.5D, 3D and SiP Test
   Analog/Mixed-Signal/RF Test
   ATE hardware and software
   ATPG, test synthesis
   Design-for-Test: chip, board, system
   Design and test for reliability
   Diagnostics
   Failure analysis
   Hardware Security
   IDDQ and current test
   Memory test
   Microprocessor Test
   Power issues in test
   System-on-Chip test
   System-in-Package test
   Test and design for manufacturability
   Test for nanometer technologies