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Day 1- Mar.21st, 2024
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08:30-09:20
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Registration / 注册
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09:20-09:25
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Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
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Moderator / 主持人：
David Xiao, Board Chair of AccoPower
肖国伟，广东芯聚能半导体有限公司，董事长
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09:30-09:55
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MicroLED Technology Entering Mass Production: Opportunities and Challenges in The New Era
MicroLED技術的量產：機會與挑戰的新時代
李允立，錼創科技，董事长
Dr. Yun-Li (Charles) Li, Chairman of PlayNitride Inc.
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09:55-10:20
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大尺寸SiC单晶衬底制备
杨昆，河北同光半导体股份有限公司，总工程师
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10:20-10:45
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How Power and Compound Semiconductor Drive Sustainable Innovation
功率和化合物半导体如何推动可持续创新
Francesco MUGGERI, VP of Power Discrete & Analog Products, APeC&China, STMicroelectronics
Francesco MUGGERI，意法半导体，亚太区功率分立和模拟产品器件部市场和应用副总裁
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10:45-11:10
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Compound Semiconductor Infrared Measurement Technology and Equipment
化合物半导体红外量测技术与设备
任杰，盖泽华矽半导体科技（上海）有限公司，总经理&首席执行官
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11:10-11:35
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Ion Implantation and Applications for Power Device
Causon Ko-Chuan JEN, Ph.D. SVP, Technical Marketing, Axcelis Technologies,Inc.
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11:35-12:00
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Enabling Solutions for the High-Volume Manufacturing of GaN Devices
氮化镓器件批量生产的解决方案
Elpin Goh, Senior Director, Specialty Technologies, Lam Research Corporation
Elpin Goh，泛林集团，客户支持事业部特色工艺资深总监
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12:00-13:30
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Break / 休息
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Moderator / 主持人：
Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融，南京百识电子科技有限公司，总经理
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13:30-13:55
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Development of Silicon Carbide Epitaxy and Wafer Manufacturing Technology
碳化硅外延与晶圆技术发展
Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融，南京百识电子科技有限公司，总经理
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13:55-14:20
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Ahead of What’s Next with ASM’s Silicon Carbide Epitaxy
ASM 碳化硅外延技术赋能未来
Krishna Sreerambhatla, Vice President, Head of SiC Epitaxy business, ASM
Krishna Sreerambhatla, ASM副总裁，SiC外延业务负责人
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14:20-14:45
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Accelerating Si, SiC & GaN Power Devices’ PPACt (Power, Performance, Area, Cost, Time to Market) Scaling
加速 Si, SiC 以及 GaN 功率器件的PPACt (功率，性能，面积，成本，产品上市时间) 技术迭代
Dr. Yi Zheng, Senior Director, ICAPS, Applied Materials
郑毅，应用材料公司ICAPS事业部高级总监
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14:45-15:10
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SiC Wafer Polishing Process and Prediction of Its Developing
碳化硅晶片抛光工艺及其发展预测
王永成，上海致领半导体科技发展有限公司，总经理
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15:10-15:35
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Advanced Sinter Solutions from Heraeus Electronics
先进烧结解决方案
Dr.Jing Zhang, Heraeus Materials Technology Shanghai Ltd, Head of Shanghai Innovation Center, Heraeus Electronics China
张靖，上海贺利氏工业技术材料有限公司，贺利氏电子中国研发总监
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15:35-16:00
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Towards More Powerful and Reliable Future—Thermo Fisher Solutions for SiC Devices R&D and Yield Enhanced
迈向更强更可靠的未来—赛默飞半导体功率器件研发及良率提升解决方案
Xiaoxiao Cao, Senior Business Development Manager, PFA, Thermo Fisher Scientific
曹潇潇，赛默飞世尔科技，高级业务拓展经理
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16:00-16:25
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Ultra Fast Laser Technology Combined with AI Empowers Extreme Manufacturing of Compound Semiconductors
超快激光技术叠加AI赋能化合物半导体极端制造
Haoquan Fang, MegaRobo Technologies, Vice General Manager of Semiconductor Business Unit
方浩全，镁伽科技，半导体事业部副总经理
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Day 2 - Mar.22nd, 2024
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Moderator / 主持人：
徐伟，广东芯粤能半导体有限公司，总经理
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09:30-09:55
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碳化硅主驱将成为中高档电动汽车的主流
Gilbert Zhou, President of AccoPower
周晓阳，广东芯聚能半导体有限公司，总裁
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09:55-10:20
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大尺寸碳化硅单晶衬底制备技术挑战及进展
高超，山东天岳先进科技股份有限公司，CTO
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10:20-10:45
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GaN Power Device: Development and Challenges
氮化镓功率器件：发展和挑战
邱绍谚，京东方华灿光电股份有限公司，氮化镓电力电子研发总监
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10:45-11:10
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Demand Leadership, Technological Innovation, Building a New Ecosystem for China's Silicon Carbide Industry
需求引领，技术创新，构建中国碳化硅产业新生态
李仕群，北京北方华创微电子装备有限公司，行业总经理
北京北方华创微电子装备有限公司
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11:10-11:35
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High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案
Vincent Meric, Vice President, Product & Marketing, AIXTRON SE
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11:35-12:00
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EPI Application in Compound Semiconductor by Nicolet FT-IR iG50.
Nicolet iG50傅里叶变换红外在化合物半导体外延中的应用
Michael Lee, Semiconductor Measurement Manager of Thermo Fisher Scientific
李云鹏，赛默飞世尔科技，半导体晶圆材料量测负责人
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12:00-13:30
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Break / 休息
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Moderator / 主持人：
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯，苏州晶湛半导体有限公司，董事长、总裁
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13:30-13:55
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GaN Progress on Large Size of Substrates
大尺寸GaN材料的新进展
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯，苏州晶湛半导体有限公司，董事长、总裁
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13:55-14:20
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CoreGaN：助力双碳 降本增效
章涛，江苏能华微电子科技发展有限公司，产品应用副总裁
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14:20-14:45
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Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造
Dr. Wuping Liu, VP of Customer Applications & Technology of Jiangsu Leuven Instruments Co., Ltd.
刘武平，江苏鲁汶仪器股份有限公司，产品研发中心副总经理
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14:45-15:10
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Key Manufacturing Challenges in HVM of SiC and GaN Power Devices
Aditya Vyas, Vice President of Business Development, Onto Innovation,Inc.
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15:10-15:20
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Lucky Draw 幸运抽奖
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