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Sergey Savastiouk, Ph.D CEO, ALLVIA, Inc. |
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个人简介 Sergey Savastiouk, Ph.D. began his carrier as a Professor at Santa Clara University, California in 1993. After completing his MBA program in 1997, he founded Tru-Si Technologies, Inc., which pioneered ultra-thin (50um) wafer packaging equipment and applications. Atmospheric Downstream Plasma (ADP) systems and NoTouch handling solutions have been used in production of smart cards and ultra-thin packages. In 2003, he founded ALLVIA, Inc., through silicon via (TSV) and through glass via (TGV) specialty foundry, which has been commercializing through wafer capabilities for semiconductor, RF, Optoelectronic and MEMS industries. 摘要 Glass interposers are expected to be adopted in ultra-high i/o pitch density applications such as in communications, network and signal processing and testing, high bandwidth memory (HBM), high-performance computing such as in opto-electronics based computing, and radio frequency (RF). Glass interposers also find adoption in low-cost packaging applications such as micro-electro mechanical systems (MEMS), sensor, power, and analog devices among others. Presentation offers technology for higher interconnect density than organic interposers, but also at a significantly lower cost when compared to a silicon interposer with similar interconnect density. |
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