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March 20-22, 2019
Shanghai New International Expo Centre

New Technology Release Conference 2018

New Technology Release Conference

Date: Friday, March 16, 2018
Venue: New Tech Stage ,Hall E7, Shanghai New International Expo Centre

Attendee Registration

To promote new technology, there is no better way than direct interaction with customer. No matter if you have a new IC, a new IOT solution, a new machine or material, you might not want to miss the opportunity to talk directly with ~200 professional audiences from world wide in the largest Semiconductor exhibition. So join us in the "New Technology Release Conference" !

*Free of charge
Sponsors:  
日程 / Agenda:

Moderator / 主持人:
Richard Qian 钱立群
东电电子(上海)有限公司,战略市场总监
   
10:30-10:45
Dicing Fluids: the Key Element for Smart Dicing
追求高效产能的切割要素

Qi Wu 吴琦
Deputy General Manager of China Region, Nippon Pulse Motor Trading(Taiwan)Co., Ltd.
台灣日脈貿易股份有限公司,中国区域副总经理
   
10:45-11:00
Inside of 10 nm technology node
Dr. JC Chen 陈荣钦 博士
CTO, MSSCORPS CO., LTD
汎铨科技,技术长
   
11:00-11:15
Mega Service Platform of MIC2025
Brian Kim
COO, Semiconductor Global Solutions
   
11:15-11:30
Go forward, Opening a new chapter for domestic ION Implanter
砥砺前行,开启国产离子注入机新篇章

曾晓斌
北京中科信电子装备有限公司,总经理
   
11:30-11:45
MultiPlate: a new tool for next generation power semiconductors
Cassandra Melvin
Global Product Manager, SC/FEC, Atotech
   
11:45-12:00
Lowering the Cost of Test while Improving Time-To-Market with a Platform-based Approach
从实验室到量产——平台化方法降低测试成本

马力斯
美国国家仪器,技术市场工程师
   
12:00-13:00 Lunch on own
   
Moderator / 主持人:
Xu Dongmei 徐冬梅
天水华天电子集团,国家认定企业技术中心主任、兼任天水华天电子集团股份有限公司副总经理
   
13:00-13:15
Innovative Process and Equipment Technology Solutions for 3DIC SiP Packaging
3DIC SiP创新的工艺与设备技术解决方案

Albert Lan 蓝章益
Global Packaging TD, Applied Materials
   
13:15-13:30
Integrated Equipment Data Collection and Management for Smart Manufacturing
Mr. Alan Weber
Vice President, New Product Innovations, Cimetrix Incorporated
   
13:30-13:45
The application of TIMs in the electronic industry
界面导热材料在电子行业的运用

Xin Zhong 钟欣
Director of technology, GUANGDONG SUOREC TECHNOLOGY CO., LTD
广东硕源科技股份有限公司,技术总监
   
13:45-14:00
Introduction to Kingsemi and its latest photolithography track technology
芯源公司概况及最新前道设备技术简介

Xinglong Chen 陈兴隆
CTO of KINGSEMI Co., Ltd.
沈阳芯源微电子设备有限公司,技术长
   
14:00-14:15
Advanced Dispense Technology for Semiconductor Packaging
半导体封装的先进点胶技术

Eric Gu 顾巍巍
Application Manager, Nordson ASYMTEK
Nordson ASYMTEK,应用技术经理
   
14:15-14:30
Breakthrough of a Few Photoresists
几类光刻胶的突破

Sam Sun 孙逊运
潍坊星泰克微电子材料有限公司,董事长
   
14:30-14:45
K&S New Generation Ball Bonders - Rapid Pro & OptoLUX
K&S 新一代自动球焊机 Rapid Pro 和 OptoLUX

Shooter Jiang 蒋伟
Kulicke & Soffa, 中国区销售总监
   
14:45-15:45
Joint Conference of Huatian-Sumacro "Embedded Silicon Fan-Out technology and Product"
华天科技-日月成科技“硅基扇出集成技术与产品”联合发布会

Dr. Daquan Yu 于大全 博士
天水华天科技集团CTO,封装技术研究院院长,华天科技(昆山)电子有限公司副总经理

Mr. Yichen Zhao 赵一尘
Founder, Chairman, and GM of Sumacro Technologies
苏州日月成科技有限公司创始人、董事长、总经理
   
Agenda is subject to change 议程变化恕不另行通知