New Technology Release Conference
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Date:
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Friday, March 16, 2018
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Venue:
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New Tech Stage ,Hall E7, Shanghai New International Expo Centre
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Attendee Registration
To promote new technology, there is no better way than direct interaction with customer. No matter if you have a new IC, a new IOT solution, a new machine or material, you might not want to miss the opportunity to talk directly with ~200 professional audiences from world wide in the largest Semiconductor exhibition. So join us in the "New Technology Release Conference" !
*Free of charge
日程 / Agenda:
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Moderator / 主持人：
Richard Qian 钱立群
东电电子（上海）有限公司，战略市场总监
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10:30-10:45
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Dicing Fluids: the Key Element for Smart Dicing
追求高效产能的切割要素
Qi Wu 吴琦
Deputy General Manager of China Region, Nippon Pulse Motor Trading(Taiwan)Co., Ltd.
台灣日脈貿易股份有限公司，中国区域副总经理
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10:45-11:00
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Inside of 10 nm technology node
Dr. JC Chen 陈荣钦 博士
CTO, MSSCORPS CO., LTD
汎铨科技，技术长
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11:00-11:15
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Mega Service Platform of MIC2025
Brian Kim
COO, Semiconductor Global Solutions
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11:15-11:30
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Go forward, Opening a new chapter for domestic ION Implanter
砥砺前行，开启国产离子注入机新篇章
曾晓斌
北京中科信电子装备有限公司，总经理
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11:30-11:45
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MultiPlate: a new tool for next generation power semiconductors
Cassandra Melvin
Global Product Manager, SC/FEC, Atotech
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11:45-12:00
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Lowering the Cost of Test while Improving Time-To-Market with a Platform-based Approach
从实验室到量产——平台化方法降低测试成本
马力斯
美国国家仪器，技术市场工程师
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12:00-13:00
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Lunch on own
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Moderator / 主持人：
Xu Dongmei 徐冬梅
天水华天电子集团，国家认定企业技术中心主任、兼任天水华天电子集团股份有限公司副总经理
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13:00-13:15
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Innovative Process and Equipment Technology Solutions for 3DIC SiP Packaging
3DIC SiP创新的工艺与设备技术解决方案
Albert Lan 蓝章益
Global Packaging TD, Applied Materials
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13:15-13:30
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Integrated Equipment Data Collection and Management for Smart Manufacturing
Mr. Alan Weber
Vice President, New Product Innovations, Cimetrix Incorporated
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13:30-13:45
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The application of TIMs in the electronic industry
界面导热材料在电子行业的运用
Xin Zhong 钟欣
Director of technology, GUANGDONG SUOREC TECHNOLOGY CO., LTD
广东硕源科技股份有限公司，技术总监
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13:45-14:00
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Introduction to Kingsemi and its latest photolithography track technology
芯源公司概况及最新前道设备技术简介
Xinglong Chen 陈兴隆
CTO of KINGSEMI Co., Ltd.
沈阳芯源微电子设备有限公司，技术长
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14:00-14:15
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Advanced Dispense Technology for Semiconductor Packaging
半导体封装的先进点胶技术
Eric Gu 顾巍巍
Application Manager, Nordson ASYMTEK
Nordson ASYMTEK，应用技术经理
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14:15-14:30
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Breakthrough of a Few Photoresists
几类光刻胶的突破
Sam Sun 孙逊运
潍坊星泰克微电子材料有限公司，董事长
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14:30-14:45
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K&S New Generation Ball Bonders - Rapid Pro & OptoLUX
K&S 新一代自动球焊机 Rapid Pro 和 OptoLUX
Shooter Jiang 蒋伟
Kulicke & Soffa, 中国区销售总监
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14:45-15:45
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Joint Conference of Huatian-Sumacro "Embedded Silicon Fan-Out technology and Product"
华天科技-日月成科技“硅基扇出集成技术与产品”联合发布会
Dr. Daquan Yu 于大全 博士
天水华天科技集团CTO，封装技术研究院院长，华天科技（昆山）电子有限公司副总经理
Mr. Yichen Zhao 赵一尘
Founder, Chairman, and GM of Sumacro Technologies
苏州日月成科技有限公司创始人、董事长、总经理
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Agenda is subject to change 议程变化恕不另行通知
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