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March 14-16,2018
Shanghai New International Expo Centre

Albert Lan

Albert Lan
Global Packaging TD, Applied Materials

Biography

Education:

  •  Master of industrial & mechanical engineering department, Univ. of Wisconsin, Madison, USA

Experience:

  •  Over 25 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
  •  Senior Engineering Center Director, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  •  PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
  •  Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  •  Chairman of TILA (Taiwan Intelligent Leader Association).
  •  Published more than 30 technical papers and granted more than 15 issued worldwide Patents.

Abstract

  •  Albert Lan obtained his master degree from Industrial & Mechanical Engineering department, Univ. of Wisconsin, Madison, USA.
  •  Over 25 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies, such as bumping, Flip Chip, Fan Out, and 2.5D.
  •  He ever was Senior Engineering Center Director in SPIL for 13 years, which is top 3 biggest packaging house in the world.
  •  He also ever taking care of bumping PD, and Quality jobs in Amkor Taiwan for 5 years.
  •  Now he is Vice Chairman of SEMI Taiwan PKG&TEST Committee and Chairman of TILA (Taiwan Intelligent Leader Association).
  •  He has published more than 30 technical papers and granted more than 15 issued worldwide Patents.