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Albert Lan Global Packaging TD, Applied Materials |
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Biography Experience: • Over 25 years of job experience in semiconductor industry, especially focusing on advanced wafer level packaging technologies. • Senior Engineering Center Director, 13 years, SPIL, which is top 3 biggest assembly house in the world. • PD, Quality, & Sales, 6 years, Amkor Taiwan(Bumping) • Vice Chairman of SEMI Taiwan PKG&TEST Committee • Chairman of TILA (Taiwan Intelligent Leader Association). • Published more than 50 technical papers and granted more than 20 issued worldwide Patents. |
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