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March 18-20, 2020
Shanghai New International Expo Centre

Albert Lan

Albert Lan
Global Packaging TD, Applied Materials

Biography

Experience:

  •  Over 25 years of job experience in semiconductor industry, especially focusing on advanced wafer level packaging technologies.
  •  Senior Engineering Center Director, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  •  PD, Quality, & Sales, 6 years, Amkor Taiwan(Bumping)
  •  Vice Chairman of SEMI Taiwan PKG&TEST Committee
  •  Chairman of TILA (Taiwan Intelligent Leader Association).
  •  Published more than 50 technical papers and granted more than 20 issued worldwide Patents.