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English
March 14-16,2018
Shanghai New International Expo Centre

Dr. Daquan Yu


Dr. Daquan Yu
天水华天科技集团CTO,封装技术研究院院长,华天科技(昆山)电子有限公司副总经理

Biography

Dr.Daquan Yu is the CTO,President of Research Academy of Advanced Packaging Technology ofHuatian Group, and Vice President of Huatian Technology (Kunshan) Electronic Co., Ltd. He has authored or co-authored more than 150 peer-reviewed technical publications. He holds more than 40 patents. He is an IEEE senior member since 2013.

Abstract

Abstract: Wafer-level Fan-Out (WL-FO) is a key technology, which not only provides a system scaling solution but also complements the chip scaling and helps to sustain the Moore’s Law. The embedded silicon fan-out (eSiFO®) technology, which was developed by Huatian Technology has proprietary intellectual property rights. The eSiFO® technology has combination of accuracy silicon etching, wafer re-construction and high density RDLs. The advantages include small form factor, low cost, simple process, small warpage, high yield and it is a platform technology for multi-die SiP and 3D integration. The eSiFO® technology is regarded a significant achievement on leading edge advanced packaging field. Sumacro Technologies is focus on LED display marketing, providing innovation IC solution with leading technology, high quality and excellent performance. Huatian has been working with Sumacro for SiP using eSiFO® for LED driver and controller ICs. The ICs developed by Sumacro Technologies with high display performance, advanced power reduction technology were applied to HD LED display. With adoption of eSiFO®, multi-chips were successfully integrated in an ultra small silicon die to form a SiP achieving simple SMT, good performance/cost value.