Symposium IX: Design and Automation of Circuits and Systems
Symposium Committee
Symposium IX: Design and Automation of Circuits and Systems
• Circuit Design Techniques and Methodology
- Novel digital, analog and mixed signal design
- Design and implementations
• Design tools and methodology
- Synthesis
- Timing
- Physical design
- Design for test
• Design Verification
- Functional verification
- Verification using hardware accelerators and/or FPGA
• Design for Manufacturability and Reliability
• Design and Process interaction
• System Integration
- System packaging
- Power
- Thermo/cooling
- System interconnect
- System reliability
• System Software
- Control
- Firmware
- Operating systems
- User programming interfaces
• Applications
- Mobile applications
- Embedded system applications
- Low power wearable and medical computing applications
- Innovative sensor network applications
- High performance computing applications
Symposium Committee
Prof. Pingqiang Zhou Chair |
Shanghai Tech University, China |
Prof. Yanan Sun Co-Chair |
Shanghai Jiao Tong University |
Prof. Jun Tao Member |
Fudan University |
Prof. Aili Wang Member |
Zhejiang University |
Prof. He Li Member |
Southeast University |
Prof. Haibao Chen Member |
Shanghai Jiaotong University |
Prof. Changhao Yan Member |
Fudan University |
Prof. Zhufei Chu Member |
Ningbo University |
Prof. Yu-Guang Chen Member |
National Central University, Taiwan, China |
Dr. Wei Chen Member |
Alibaba |
Prof. Yongqiang Lvu Member |
Tsinghua University |
Prof. Jianlei Yang Member |
Beihang University |
Prof. Lang Feng Member |
Sun Yat-Sen University |
Prof. Xin Lou Member |
ShanghaiTech University |
Symposium IX: Design and Automation of Circuits and Systems
• Circuit Design Techniques and Methodology
- Novel digital, analog and mixed signal design
- Design and implementations
• Design tools and methodology
- Synthesis
- Timing
- Physical design
- Design for test
• Design Verification
- Functional verification
- Verification using hardware accelerators and/or FPGA
• Design for Manufacturability and Reliability
• Design and Process interaction
• System Integration
- System packaging
- Power
- Thermo/cooling
- System interconnect
- System reliability
• System Software
- Control
- Firmware
- Operating systems
- User programming interfaces
• Applications
- Mobile applications
- Embedded system applications
- Low power wearable and medical computing applications
- Innovative sensor network applications
- High performance computing applications