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Education:
· M.A., Physical electronics and photo electronics, University of Electronic Science and Technology of China, 2001
· B.A., Physical electronics and photo electronics, University of Electronic Science and Technology of China, 1998
Work experience:
Principle process engineer of ICRD of Shanghai, 2001-present,
Mainly responsible for advance process development at ICRD, focus on etching process and some advance patterning process development such as 14nm FinFet patterning etc.
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