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Dr. Chuan Hu received his BS in physics from Beijing University in year 1992 and PhD from Univ. of Texas in year 2000. He worked on high density packaging, heterogeneous integration and wearables in the components research group at Intel Corporation for 14 years from year 2001 to 2014. His PhD. research work was primarily funded by SRC and he later became an industrial liaison of the organization and many other research consortiums such as IFC, NSF, Sematech, etc., which gave him a unique insight on how industrial research corporations and government team up to overcome technical barriers of our industry. When he worked at Intel, he mentored projects from major universities in USA and worldwide and he collaborated with hundreds of suppliers worldwide to develop technologies to elongate the life time of Moore's law.
In 2014, he left Intel to start a company working on nanomaterial sensors and became one of the national thousand talent members of China. In 2018, he joined Guangdong academy of science to build a platform for heterogenous integration. He has co-authored nearly 40 technical papers in the fields of heat transfer, electronic packaging, backend reliability, nano-material and EUV lithography and has over 140 issued or pending patents in USA, Japan, Taiwan, China and etc.
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