Symposium Chair: Dr. Steve X. Liang
| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 20 min |
Monday, March 24, 2025 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I: Packaging and Assembly
Session Chair: Steve X. Liang
| 13:00-13:05 | Opening Remark |
| Steve X. Liang | |
| **13:05-13:35 | Characterizing the Anisotropic Dielectric Constant of Package Material Considering the Fiber-Weave Effect |
| Wei Lin, JCET Group | |
| *13:35-14:00 | Advanced Packaging for CPO, Optical in Package Solution |
| Steve Jin, OPI Singapore | |
| *14:00-14:25 | Advanced Panel Level Package Driven for Chiplet and Glass Core Technology |
| Tingyu Lin, Fozhixin Microelectronics Research Co., Ltd. | |
| 14:25-14:40 | Study on Key-factors Analysis of ELK Dielectric Stress |
| Xiaoyan Li, Sanechips Technology Co.,Ltd. | |
| 14:40-14:55 | A Streamlined Electro-Thermal-Mechanical Simulation Method for Power Semiconductor Packaging Design |
| Zixiao Huang, Sinesemi (Shanghai) Semiconductor Co., Ltd. | |
| 14:55-15:10 | Effects of Geometry and Surface Flatness on Direct Wafer Bonding by Multiphysics Modeling |
| Sichen Liang, Sun Yat-sen University | |
| 15:45-17:55 | Poster Session |
Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room: 5B+5C
Session II: Packaging and Assembly
Session Chair: Steve X. Liang
| *9:00-09:25 | Cu Pad height Measurement for Wafer to Wafer Bonding Process by Utilizing SEM Quad-Detector |
| Yujie Xu, Hitachi High-Tech Corp | |
| 09:25-09:40 | Application of System in Package Technology in Satellite Internet |
| Jin Yang, Southeast University | |
| 09:40-09:55 | Investigating and Mitigating Gold Wire Stitch Breakage Failures in Tire Pressure Monitoring Sensor |
| Jingwei Sun, NXP | |
| 09:55-10:10 | Solution to Sidewall Roughness of High Aspect Ratio TSV Etch in Advanced Packaging |
| Yun Xiao, Lam Research | |
| 10:10-10:25 | AI-driven Optimization for FCBGA PKG RF SI |
| Shineng Ma, Sanechips Technology Co.,Ltd. | |
| Poster Session: | |
| Thicker and Better Semiconductor Passivation Layers for Zero Defect Automotive Applications ON 12-Inch 90-nm BCD Process | |
| Wenwu Zhu, Huahong Semiconductor(Wuxi) | |
| Near Zero Residue High Reliability Novel Solder Paste for Electronics | |
| Yanfang Li, Indium Company | |
| Long Process Kits Lifetime in Volaris2 for Pre-clean | |
| Shiwei Zhang, Applied Materials | |
| Comparison of Simulation and Actual Test Results and Selection of Molding Material in Flip-Chip Package | |
| Chong Dong, Sanechips Technology CO.,Ltd. | |
| SAFO Packaging Technology | |
| Renjie Gu, Shanghai Yibu Semiconductor Co., Ltd. |