Symposium Chair: Dr. Steve X. Liang
| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 20 min |
Sunday, March 17, 2024 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I: 3D and Advanced Packaging Technologies
Session Chair: Steve X. Liang
| 13:30-13:35 | Opening Remarks |
| *13:35-14:00 | Chiplets and Advanced Packaging for Future Computing |
| Terry Wu, Samsung Electronics | |
| 14:00-14:20 | Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect |
| Yasuhiro Morikawa, ULVAC, Inc. | |
| 14:20-14:40 | Comprehensive Investigation of Insufficient IMC in SOIC Through Advanced Statistical Analysis |
| Jingwei Sun, NXP Semiconductors | |
| **14:40-15:10 | Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH) |
| Eason Wang, ICLeague | |
| 15:10-15:30 | Coffee Break |
Session II: Novel Packaging Materials and Process
Session Chair:
| 15:30-15:50 | Hybrid Wafer-to-Wafer and Die-to-Wafer Technology for Heterogenous Integration Applications |
| Viorel Dragoi, EV Group | |
|
15:50-16:10 |
Glass As An Enabling Material for Advanced Packaging |
| Jay Zhang, Corning Incorporated | |
Monday, March 18, 2024 Shanghai International Convention Center
Meeting Room: 5B+5C
Session III: Inspection, Test and Reliability
Session Chair: X. Wu
| *09:00-09:25 | Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations |
| Jialin Zheng, Sanechips Technology Co., Ltd. | |
| 09:25-09:45 | A Modularized Thermal Test Chip Design and Verification |
| Jianjun Sun, Sanechips Technology Co., Ltd. | |
| 09:45-10:05 | Evaluating 224G SI Performance of Vertical Interconnections on Package Substrate and PCB |
| Kai Yuan, Sanechips Technology Co., Ltd. | |
| 10:05-10:20 | Coffee Break |
Session IV
Session Chair: M. Huang
| 10:20-10:40 | Heat Transfer Improvement of Phase Change Material with Metal Foam |
| Yan Zhang, Shanghai University | |
| *10:40-11:05 | Study of Defects in Advanced Packing at the Atomistic Scale by Using In Situ TEM |
| Xing Wu, East China Normal University | |
| *11:05-11:30 | The Solution and Challenge of Glass Core Substrate Technology |
| Tingyu Lin, Guangdong FoZhiXin (FZX) Microelectronics Technology Research Co., Ltd. | |
| *11:30-11:55 | Breaking Memory Wall with SeDRAM® Technology in Chip Level |
| Fengguo Zuo, Xi'an UniIC Semiconductors Co., Ltd. | |
| Thermal and Thermal Stress Simulation Analysis of Embedded Microchannel Cooling on Large-Size Packaging | |
| Fusheng Meng, Sanechips Technology Co., Ltd. | |
| Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package | |
| Yubo Wang, Sanechips Technology Co., Ltd. | |