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Professor Haedo Jeong received B.S. degree from Pusan National University, Korea in 1987 and the M.S. degree and Ph.D. in mechanical engineering from KAIST, Korea in 1989 and from University of Tokyo, Japan in 1994, respectively. His PhD thesis was "A study on planarization of device wafer using abrasive process" as a first thesis in the world. From 1989 to 1991, he worked at government research institutes of KIST and KITECH, where he was responsible for abrasive machining process such as grinding and polishing. In 1994, he joined at Japanese government project with RIKEN and Fujikoshi machinery, Japan as a post-doc. researcher to develop a CMP equipment.
From 1995, he is working as a professor in the school of mechanical engineering as well as a director of CMP laboratory at Pusan National University which is one of three major universities in Korea CMP field. He has also served as a director of LINC (Leaders in INdustry-university Cooperation) government project for 4 years from 2013. His research interests include wafering processes, chemical mechanical polishing and its post cleaning. He has authored in more than 600 technical publications/presentations in the area of CMP including 148 SCI papers and 120 Korean papers. He is an emeritus president of Korea CMPUGM and an executive committee member of International Conference on Planarization/CMP Technology (ICPT) which is the largest CMP conference in the world. He is also a founder and president of G&P Technology which is one of the strongest R&D CMP tool suppliers with more than 200 sales record, founded in 1999.
He served as a president of Korean Society of Precision Engineering (KSPE) in 2019 and an editor-in chief of international journal of precision engineering and manufacturing - green technology (IJPEM-GT) for recent 5 years. Thanks to his contribution, he got many awards and medals from 30 different organizations including government. He may be reached at 82-51-510-2463 or by email hdjeong@pusan.ac.kr.
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