Symposium Chair: Dr. Xiaowei Li, ICT, CAS, China
| * | to designate invite talk - 25 min | Sponsored by: |
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| to designate regular talk - 15 min |
Sunday, March 17, 2024 Shanghai International Convention Center
Meeting Room: 3B
Session I: Test I
Session Chair: Xiaowei Li
| 13:30-13:35 | Opening Remarks |
| *13:35-14:00 | Jitter reduction for multi-GHz ATE up to 20 GHz |
| Dave Keezer, Eastern Institute for Advanced Study (EIAS) in Ningbo, China. | |
| *14:00-14:25 | Assessing the Power-Awareness of VLSI Testing |
| Xiaoqing Wen, Kyushu Institute of Technology, Japan | |
| 14:25-14:40 | An Efficient Library for Protocol Test on V93000 |
| Peifeng Ni, Advantest (China) Co., Ltd. | |
| 14:40-14:55 | Address the challenges of mass production testing for 5G millimeter devices |
| Daniel Sun, Advantest (China) Co., Ltd. | |
| 14:55-15:10 | Highly multi-sites front end test solution design and implementation for automotive testing |
| Kaitao Liu, Advantest (China) Co., Ltd. | |
| 15:10-15:25 | Mirroring ATPG Technology for Multi-Core Chips |
| Jitong Zhou, Sanechips Technology | |
| 15:25-15:40 | Deep Reinforcement Learning-Based Automatic Test Pattern Generation |
| Wenxing Li, Institute of Computing Technology, Chinese Academy of Sciences | |
| 15:40-15:55 | Coffee Break |
Session II: Metrology I
Session Chair:
| *15:55-16:20 | Doping level detection in Si or SiGe via In-Line Raman Spectroscopy |
| Ilya Osherov, Nova Ltd. | |
| 16:20-16:35 | Investigation on the root cause of ESD failure of large size WBBGA package chip |
| Yunhe Zhang, Sanechips Technology Co., Ltd. | |
| 16:35-16:50 | The Influence of Pin Position on CDM Peak Current of Chips Based on Large-Sized CoWos Package |
| Liyi He, Sanechips Technology Co., Ltd. | |
| 16:50-17:05 | Depth-profile Analysis of AlAsGa film via Grazing Incident X-ray fluorescence |
| Xujun Li, Shenzhen Angstrom Excellence Semiconductor Technology Co., Ltd. | |
Monday, March 18, 2024 Shanghai International Convention Center
Meeting Room: 3B
Session III: Test II
Session Chair:
| *08:30-08:55 | Polymorphic Circuits Design and Applications in Security |
| Gang Qu, University of Maryland, USA | |
| 08:55-09:10 | Breakthrough the test challenges for the latest Beidou navigation and satellite communications chips |
| Xi Liu, Advantest (China) Co., Ltd. | |
| 09:10-09:25 | Advanced Digital Baseband Signal Generation and Processing Solution for V93000 5G Small Cell Transceiver Testing |
| Bank Liu, Advantest (China) Co., Ltd. | |
| 09:25-09:40 | Various Driver test Summary on V93000 in Automotive Device |
| Yang Lin, Advantest (China) Co., Ltd. | |
| 09:40-09:55 | A new fast XRD apparatus for the epitaxial films with a focusing X-ray Beam |
| Yankun Sun, Shenzhen Angstrom Excellence Semiconductor Technology Co., Ltd. | |
| 09:55-10:10 | An Efficient Protocol ATE Solution for Driver IC on Advantest T6391 |
| Xiang Cai, Advantest (China) Co., Ltd. | |
Session IV: Metrology II
Session Chair:
| *10:10-10:35 | MI's solutions for next era |
| Byoung-Ho Lee, Hitachi High-Tech Corporation | |
| 10:35-10:50 | Metryx solution for dishing defect in Ultra thick metal ECP process |
| Joey Hu, Lam Research | |
| 10:50-11:05 | Assessing Brittleness of Substrates and Thin Layers with Nanoindentation |
| Zhiming Zhang, KLA Instruments Group | |
| 11:05-11:20 | Advantages of Picosecond Laser Acoustics to Process Control of Semiconductor Power Devices |
| Johnny Dai, Onto Innovation | |
| 11:20-11:35 | Multi-physics Simulation of Electromigration in Cu Interconnect |
| Xuefeng Zhang, Beijing NAURA Microelectronics Equipment Co., Ltd. | |
| 11:35-11:50 | Analysis and Protection Solution for Aging DC-stress Induced Waveform Distortion Issues |
| Haiyong Wang, Sanechips Technology Co., Ltd. | |
| 11:50-12:05 | Modern X/Y metrology system addressable to mature semiconductor nodes |
| Xueying Hai, Mycronic AB | |
| 12:05-13:30 | Lunch Break |
Session V: Reliability
Session Chair:
| *13:30-13:55 | Signal and Power Reliability for Integrated Chips and Chiplets |
| Lei He, UCLA, USA | |
| 13:55-14:10 | Electro Optical Time Domain Reflectometry for Advanced Package Failure Analysis |
| Longhai Liu, Advantest (China) Co., Ltd. | |
| 14:10-14:25 | Test solution to prevent Dynamic Voltage Stress burning issue on ATE |
| Haijing Wu, Advantest (China) Co., Ltd. | |
| 14:25-14:40 | Reliability challenges in SiC components – performing dynamic test methodologies like DGS for meaningful measurement results |
| Sandro Strasser, SET GmbH, NI | |
| 14:40-14:55 | Study on Failure Mechanism of C4 Bump Solder Excursion in CoWoS Package |
| Xixiong Wei, Sanechips Technology CO., Ltd. | |
| 14:55-15:10 | Coffee Break |
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Session VI: Test III Session Chair: |
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| *15:10-15:35 | Scaling of Memory Performance and Capacity with Memory Processor |
| Fei Wang, Shandong University | |
| 15:35-15:50 | Novel Process Control Solutions for Advanced Power and Automotive Semiconductor Devices |
| Terry Chen, Applied Materials | |
| 15:50-16:05 | A Dynamic Reusable Structure of I/O Pads for Scan Chains |
| Qi Cheng, Sanechips Technology | |
| 16:05-16:20 | V93000 test solutions introduction for Audio PA device |
| Junlin Wang, Advantest (China) Co., Ltd. | |
| 16:20-16:35 | A Closed-loop Chip Fast Binning Technology |
| Jiawei Wang, Sanechips Technology | |
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Poster Session: |
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| Test solution of mini-LVDS interface transmitter for media chip on V93000 platform | |
| Ying He, Advantest (China) Co., Ltd. | |
| Testing implementation and challenges of processor with power path switching feature | |
| Liuhao Chen, Advantest (China) Co., Ltd. | |
| A fast measurement scheme for high-speed loopback pin continuity testing | |
| Liuhao Chen, Advantest (China) Co., Ltd. | |
| A New Flexible Binning Method in ATE Production | |
| Hanru Zhang, Advantest (China) Co., Ltd. | |
| A Universal DPAT GUI Solution for Production Test | |
| Hao Chen, Advantest (China) Co., Ltd. | |
| Picosecond Ultrasonics Applications on Electroplated Cu Process | |
| HuaYuan Li, Onto Innovation | |
| A Robust Calibration Test Solution for High-Performance Computing SoC Tsensors | |
| Yang Zhang, Advantest (China) Co., Ltd. | |
| A common framework solution for firmware test on V93000 ATE platform | |
| Yanyan Chang, Advantest (China) Co., Ltd. | |
| Study of Coating Effect on TEM Sample Damage and Elemental Analysis | |
| Yun Xu, SMIC | |
| A Universal Auto Configured Efuse Solution on ADVANTEST V93000 ATE Platform | |
| Yefang Wang, Advantest (China) Co., Ltd. | |
| Optimized Filling Capacity in HARP Process for STI void Defect Improvement in 28nm Technology | |
| Zhimin Zhang, Shanghai Huali Integrated Circuit Corporation | |
| Influence of Foup Environment On Defects in Semiconductor manufacturing | |
| Weiwei Zhao, Shanghai Huali Integrated Circuit Corporation | |
| Streamlining Chip Testing with Simplified Digital Data Acquisition | |
| Felix Chen, Advantest (China) Co., Ltd. | |
| Comparison of simulation and test results of multi-type ring oscillators on advanced process nodes | |
| Kuili Chen, Sanechips Technology | |
| Optimization and Validation of Sampling and TD-GCMS Analysis for Volatile Organic Compounds from Semiconductor Cleaning Coupons | |
| Ling Wang, Ferrotec Technology Development (Shanghai) Co., Ltd. | |
| Application of Pulse Id-Vg Technique on 55nm Low Power Platform | |
| Gang WANG, Hangzhou HFC Semiconductor Corporation | |
| New Generation Test Framework Solution for Complicated Multi-Die Chip on ATE | |
| Kai Zhou, Alibaba-Thead | |
| Virtual Measurement Combine OCD and FDC through Optimized Random Forest Machine Learning Algorithm Assists on Post Etching Monitor | |
| Qingyun Yang, SiEn (Qingdao) Integrated Circuits Co., Ltd. | |
| Characterization of Ultrathin Films in HKMG by Spectroscopic Ellipsometer | |
| Yufan Zhang, Shenzhen Angstrom Excellence Semiconductor Technology Co., Ltd. | |
| Study on STEM EDS for GeSi Atomic Layer Interface Identified and Concentration Quantified | |
| Fan Zhang, SMIC | |
| An optimized ADC&DAC test solution from SmartScale MCx to ExaScale WSMX | |
| Tianyu Zhang, Advantest (China) Co., Ltd. | |
| Spectra Machine Learning for the Prediction of Sheet Resistance and Capacity | |
| Shang Li, SiEn (Qingdao) Integrated Circuits Co., Ltd. | |
| Quantitative analysis of the damage degree of the single-crystal silicon induced by ion implantation using an optical approach | |
| Emma Wu, SiEn (Qingdao) Semiconductor corporation Co., Ltd. | |
| Detecting the B concentration in the SiGeB epilayers utilizing a hybrid approach combining HR-XRD and XPS | |
| Emma Wu, SiEn (Qingdao) Semiconductor corporation Co., Ltd. | |
| A new multi-mode X-ray fluorescence apparatus for both blanket and pattern wafer film metrology | |
| Yuxiang Huang, Shenzhen Angstrom Excellence Technology Co., Ltd. | |
| The Influence of Metal Barrier Punch Through Process on Dielectric Reliability at 55nm CMOS node | |
| Chenxiao Xu, Zhejiang University | |
| Tunability Demonstration of RadiancePlus® on Spike Anneal Process | |
| Xiaolong Wang, Applied Materials | |
| Sample Preparation Method for In-Situ Tem Analysis in Integrated Circuits | |
| Guoyang Ye, Semiconductor Manufacturing International (Shanghai) Corporation Failure Analysis Laboratory | |