|
Durga Chaturvedula Managing Director, 200mm Product Mgmt. & Technology, Applied Materials |
|
个人简介 Durga Chaturvedula has been working at Applied Materials for more than 20 years. He started his career at Applied Materials as a Product Manager in the PVD division and subsequently held product management positions in Tungsten CVD and CMP divisions. His focus is currently on developing new applications/ technologies to address customer needs in power devices, MEMS, analog, and packaging segments. He received his Masters in Engineering from University of Hawaii and an MBA from Santa Clara University. 摘要 The Future of Power Devices and Implications for Semi Equipment Power electronics are the backbone of virtually every electronics-based product in use today, ranging from smartphones and tablets, televisions and gaming consoles, VR and AR sets and wearables, to automobiles, trains, airplanes, power plants and windmills. Leading-edge semiconductor device technologies, driven by Moore’s Law, such as FinFET, 3D NAND, and DRAM enable the brains and data storage for many of these varying products. Equally important in today’s technology world where battery life, form factor, and weight continue to be increasingly critical are Power Devices. Mainly comprised of power MOSFETs, IGBTs, Diodes, Thyristors, and Power Management ICs, Power Devices are the heart of power electronics. This growing device market expects healthy growth at 5.3% CAGR from 2015-2021 (Yole Status of the Power Electronics Industry, June 2016). Power Devices resides in the ‘More than Moore’ space, not driven by technology node scaling, but rather by switching speed and power efficiency at high voltages, frequencies and temperatures. Generations of Power Devices have evolved over the last few decades, based on continuous optimization of Si-based semiconductor device structures. However, due to intrinsic limitations of Si-based devices, performance improvements have been incremental and less significant in recent years, thus paving the path for Wide Band Gap (WBG) materials such as SiC and GaN. This talk will cover Power Device market trends, device evolution and challenges, and implications for semiconductor manufacturing equipment. |
|
