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Albert Lu CTO, Interlink Electronics |
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个人简介 Dr Albert Lu is the Chief Technology Officer of Interlink Electronics Inc. His key responsibilities include spearheading strategic technology roadmap, pursuing synergistic global R&D partnerships, leading global R&D team and maintaining Interlink Electronics' competitive advantage in the human-machine interface technology landscape. Prior to joining Interlink Electronics, Dr Lu was with Singapore Institute of Manufacturing Technology (SIMTech) for 15 years. In this role, he orchestrated R&D collaborations and industry consortia in disruptive and emerging technology platforms with multinational corporations and local enterprises. He also established and spearheaded Singapore's key R&D facility and pilot line for roll-to-roll manufacturing of functional films and printed electronics. Dr. Lu holds both Ph.D. and B. Eng. in electrical engineering from the University of Manchester Institute of Science and Technology in the U.K. He also received the Lee Kuan Yew Award for Mathematics and Science in Singapore and the Institution of Electrical Engineers Prize in the U.K. Title Translating Flexible Hybrid/Printed Electronics into Innovative Human-Machine Interface (HMI) and IoT Solutions Abstract Consumer demand for seamless connectivity and interactive user interfaces is driving a paradigm shift in the Internet of Things (IoT) landscape. Flexible hybrid /printed electronics, comprising of multi-disciplinary disruptive technology platforms, will enable novel physical form factor and intelligent surfaces. The presentation will provide an overview of flexible hybrid/printed electronics technology platforms and the value chain across functional materials, manufacturing processes, devices and applications. Case studies of Interlink Electronics' success in translating flexible hybrid/printed electronics based force sensing device platforms into industry-first human-machine interface solutions will also be provided. Synopsis Consumer demand for seamless connectivity and interactive user interfaces is driving a paradigm shift in the Internet of Things (IoT) landscape. Flexible hybrid /printed electronics, comprising of multi-disciplinary disruptive technology platforms, will enable novel physical form factor and intelligent surfaces. These new attributes can be harnessed in product design and innovation to enhance human-machine interface functionality across IoT devices, systems and applications. This presentation will provide an overview of flexible hybrid/printed electronics technology platforms and the value chain across key disciplines including functional materials, manufacturing processes, devices and applications. The presentation will provide case studies of Interlink Electronics' success in translating flexible hybrid/printed electronics based force sensing device platforms into industry-first human-machine interface solutions. This was accomplished by leveraging on vertically integrated capabilities and strategic partnerships. across the supply chain. Each case study will highlight the implementation and value proposition of adopting flexible hybrid/printed electronics based force sensing technology solutions to achieve intelligent surfaces that enhance user experience in human-machine interfaces. The presentation will conclude with the illustration of a futuristic sensor fusion platform that leverages on the convergence of flexible hybrid/printed electronics based devices, MEMS devices and silicon electronics to deliver next-generation human-machine interface for wearable applications. |
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