(** to designate keynote talk, * to designate invite talk)
Sunday, March 12, 2017 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I:
Session Chair: Dr. Huili Fu
| 13:30-13:35 | Opening Remarks |
| Dr. Steve Liang, JCET | |
| **13:35-14:00 | Recent Development in 3DIC Packaging Technology |
| Dr. Shin-Puu Jeng, TSMC | |
| *14:00-14:20 | eWLB as an Innovative Integration Platform |
| Dr. Scott Sikorski, STATSChipPAC | |
| **14:20-14:45 | Role of Advanced Packaging in IC Scaling and Homogeneous and Heterogeneous Integration |
|
Dr. Hamid Azimi, Intel |
|
| **14:45-15:10 | EMI Shielding Technologies in RF Front End Modules |
| Dr. Yifan Guo, ASE | |
| *15:10-15:30 |
The Advanced Wafer Level Fan Out Packaging - SWIFTTM and SLIMTM |
|
Dr. Danny Chang, Amkor Technology China |
|
| 15:30-15:45 |
Coffee Break |
Session II:
Session Chair: Dr. Yifan Guo
| *15:45-16:05 | Key technologies and application demonstrations of 3D heterogeneous integration and FOWLP |
| Prof. Kuan-Neng Chen, NCTU | |
| *16:05-16:25 |
New Advances in MIS Technology & Application |
|
Dr. Lingzhi Chen, MIS |
|
| *16:25-16:45 | Technology Advancement of Laminate Substrates for Mobile, IoT, and Automotive Applications |
| Dr. Ken Lee, SimmTech | |
| *16:45-17:05 |
V-DOE Laser Full Cut Dicing of Thin Si IC wafers |
|
Dr. Peter Dijkstra, ASMPT Laser Separation International B.V. |
|
|
|
|
| Poster Session: | Location: Foyer of Yangtze River Hall |
| Coffee Break | Using DOE to Improve COB Bondability |
| Wei Xin, SMIC | |
| Study of white epoxy molding compound for LED bracket | |
| Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co., Ltd |
Monday, March 13, 2017 Shanghai International Convention Center
Meeting Room: 5B+5C
Session III:
Session Chair: Prof. Kuan-Neng Chen
| **8:30-8:55 | Packaging Requirements for Advanced RFIC |
|
Dr. Christian Hoffmann, Qualcomm Germany RFFE GmbH |
|
| *8:55-9:15 | The Development of Wafer Level Embedded Si Fan Out Technology for System Integration |
| Dr. Daquan Yu, Tianshui Huatian | |
| 9:15-9:30 | High-Bandwidth IC Interconnects with Silicon Interposers and Bridges for 3D Multi-Chip Integration and Packaging |
| Boping Wu, Intel Corp. | |
| 9:30-9:45 | Novel Leveling Materials for Copper Deposition in Advanced Packaging |
| Tao Ma, Shinhao Materials LLC | |
| 9:45-10:00 | Production-scale Flux-free Bump Reflow Using Electron Attachment |
| Christine Dong, Air Products and Chemicals, Inc. | |
| 10:00-10:15 | Underfill Dispensing for Chip-on-wafer |
| Akira Morita, Nordosn Asymtek | |
| 10:15-10:30 | Coffee Break |
Session IV:
Session Chair: Dr. Mark Huang
| **10:30-10:55 | Advanced Packaging System in Packaging Solder Materials Solution |
| Dr. Chan Li-san, Heraeus Electronics | |
| *10:55-11:15 | Fine Feature Solder Paste Printing for SiP Applications |
| Lim Sze Pei, Indium Corporation | |
| *11:15-11:40 |
Advanced Packaging Reliability Challenges and Solutions |
|
Dr. Richard Rao, Microsemi Corp. |
|
| 11:40-11:55 | Epoxy Molding Compound with High Adhesion on Pd Plated Lead Frames |
| Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co., Ltd | |
| 11:55-12:10 | INVESTIGATION OF THERMAL INTERFACE MATERIALS REINFORCED WITH MICRO-AND NANOPARTICLES |
| Yan Zhang, Shanghai University | |
| 12:10-12:25 | A FAST AND LOW-COST TSV/TGV FILLING METHOD |
| Jiebin Gu, Shanghai Institute of Microsystem and Information Technology | |
| 12:25-12:40 | Development of Plating Resist for FO-WLP |
| Kenji OKAMOTO, JSR Corporation | |
| 12:40-14:10 | Lunch Break |
Session V:
Session Chair: Prof. ML Huang
| **14:10-14:30 |
Enable System Integration through Wafer Level Advanced Packaging |
|
Dr.Sun Peng, NCAP |
|
| *14:30-14:50 | In-situ TEM Observations of IMC Evolution at Atomic Scale |
| Xing Wu, ECNU | |
| 14:50-15:05 | The Study on the Release Force and Adhesion of Epoxy Molding Compound |
| Wei Tan, Jiangsu HHCK advanced Materilas Co., Ltd. | |
| 15:05-15:20 | High Productivity PVD Solution for an ever-evolving Advanced Packaging Industry |
| Dr. Frantisek Balon, Evatec Ltd. | |
| 15:20-15:35 | Electrostatic Discharge Failure Control of IC Package by Epoxy Molding Compound Modification |
| Byung-Seon Kong, KCC Corporation | |
| 15:35-15:50 | Coffee Break |
Session VI:
Session chair: Dr. Tim Bao
| **15:50-16:15 | Process and Equipment Technology for Advanced Packaging |
| Dr. Arvind Sundarraja, Applied Materials | |
| *16:15-16:35 | Laser Applications in Advanced Chip Packaging |
| Dirk Müller, Coherent Inc. | |
| *16:35-16:55 |
3D & MEMS Vertical MEMS Probe Technology For Advanced Packaging |
|
Amy Leong, Formfactor |
|
| 16:55-17:10 |
Latest Material Technologies for Fan-Out Wafer Level Package |
|
Itaru Watanabe, Sumitomo Bakelite Co., LTD. |
|
| 17:10-17:25 | Morphology Control of Copper Nanomaterials for IC Bonding |
| Jiayue Wen, Harbin Institute of Technology | |
| 17:25-17:40 | Next generation coated bonding wires |
| Liao Jinzhi, Heraeus Materials Singapore Pte Ltd | |
| 17:40-17:55 |
Wafer Bonding Processes for Wafer-Level Integration of Dissimilar Materials |
|
V. Dragoi, EV Group E. Thallner GmbH |