SEMICON China - 3DIC Technology Forum 2013

SEMICON China - 同期研讨会/活动 - 超越摩尔技术论坛

3DIC Technology Forum

Date:	Wednesday, March 20, 2013
Time:	08:30 – 16:50
Venue:	Ballroom 2&3,Kerry Hotel Pudong, Shanghai
Note:	Chinese and English Simultaneous Interpretation will be provided on-site.

Sponsored by:

Program Brief

Nowadays, electronic products are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the wafer size according to Moore’s Law. However, as the scale of the chip size shrinks, Moore’s Law has reached its limit. What shall we do beyond Moore’s Law? SEMI China will hold a forum to discuss the solution of 3D Integration and analyze the market trend of this technology.

Topics:

Market Analysis of 3DIC
Approaches Overview of 3DIC Integration
New Materials in 3DIC Integration
Testing of 3DIC Integration
Modeling of 3DIC Integration
Roadmap Discussion of 3DIC in China
Challenges of 3D IC Development in China
EDA Tools Support for 3DIC
Panel Discussion

Who Should Attend

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda

Conference Host: TBD

8:30-9:00	Registration

9:00-9:10	Opening Remark Denny McGuick President & CEO, SEMI

9:10-9:40	3D Integration: where is that killer app? Subramanian S. Iyer IBM Fellow and Chief Technologist at the Microelectronics Division, IBM Systems & Technology Group

9:40-10:10	Electrical,Thermal and Mechanical Characterizations Nozad Karim Vice President, Amkor Nozad.Karim@amkor.com

10:10-10:40	Test Strategies for memory interfaces in 3D-IC Gregory Smith General Manager, Teradyne Computing & Communications Business Unit heidi.li@teradyne.com

10:40-11:10	Electrical,Thermal and Mechanical Characterizations Shiuh-Wuu Lee Sr. VP, Technology Research & Development, SMIC slides download

11:10-11:40	3D-SiP at Center Stage of Post-PC era Walter Jau Director, Corporate R&D, ASE Group http://www.aseglobal.com/en/

13:00-13:30	Challenges faced by wet process in 3D TSV application ACM David H. Wang CEO, ACM stella.yang@acmrcsh.com

13:30-14:00	ATE solutions to 3DIC test challenges: The Readiness of Advantest’s V93000 Kelvin Xia Senior director, Phd Business Strategy Development Department, Advantest kelvin.xia@advantest.com

14:00-14:20	Tea Break

14:20-14:50	Sputtering Application in Advanced Packaging Dr. Ding Peijun VP Beijing NMC Co., Ltd. zhangx@bj-nmc.cn

14:50-15:20	3D Interconnect Plating Developments -Opportunities and Challenges Dr. Zhen Qiu Liu Director of Wet Process Engineering, TEL NEXX, Inc. USA zhenqiu.liu@tel.com

15:20-15:50	TSV Technology and its Application Dr. Daniel SHI R&D Director, ASTRI (Hong Kong Applied Science & Technology Research Institute)

15:50-16:20	US Patent Topology in 3DIC Technologies and Licensing Considerations Sherry Wu Attorney-at-Law, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP slides download

16:20-16:50	3DIC & 2.5D Interposer market trends and technological evolutions Pascal Viaud CTO, Yole Développement, Taiwan Office slides download