IC设计与制造技术论坛2013

IC Application from Design to Manufacturing 

Date:	Thursday, March 21, 2013
Time:	08:30 – 15:20
Venue:	Function Room 3, Kerry Hotel Pudong, Shanghai(Shangri-La Group)
Note:	Chinese and English Simultaneous Interpretation will be provided on-site.

Sponsored by:
                 

Represented by ASMC, CSMC, SMIC, Hua Hong NEC and Grace, China local IC industry has been growing and expanding rapidly. In recent years, the gap between China and the rest of the world narrows signicantly in terms of technology and design capacity. Volume production has been achieved at 90nm, 65nm, 45nm, and even 32nm process nodes. Meanwhile, IC design occupies nearly 20% market share of the whole industry. Local design and manufacturing supplement each other well and play a key role in the development of China IC Market.

Localization is certainly an irreversible trend, and China local IC industry is set to become a strong power in the future. As an industry association serving the whole supply chain for the microelectronic, display and photovoltaic industries, SEMI China will organize “The China Market: IC Design to Manufacturing” forum in conjunction with SEMICON China 2013.

Prestigious scholars and industry experts will discuss and address on China local IC industry status and future development. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientic information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.

Topics

Advanced Technology in IC Design and Manufacturing
Future IC Development Trend and Challenges
Current IC Manufacturing Technology for Telecom
IC in Wireless System
      ——IC Design in 3G: TD-SCDMA, WCDMA, CDMA2000
      ——IC Design in 4G: LTE, WiMax
      ——Network Processor

IC in Fixed Line System
IP Needed in Communication System
IGBT& Power Management IC
LED Driver
State-of-the-Art of EDA Tools

Who Should Attend

Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Agenda
 

Conference Host: TBD
8:30-9:00	Registration
9:00-9:10	Opening Remark
9:10-9:40	Advanced analog manufacturing Service Weiping Zhou VP of Advanced Semiconductor Manufacturing Corporation [email protected]
9:40-10:10	Building China IC Manufacture Platform, Partnering for Success Jyishyang Liu Senior Vice President, Central Engineering & Services, Central Operations (Acting), SMIC
10:10-10:30	Tea Break
10:30-11:00	Innovation & Partnership to Drive Success Tony Chen President of Asia Pacific, Grace
11:00-11:30	Semiconductor Packaging Solutions in the Mobile World Dr. Yifan Guo Vice President of Engineering, ASE Shanghai http://www.aseglobal.com/en/
13:00-13:30	RF Solution for 4G Smart Phones Jim Bao Director of Engineering, RFMD, Inc
13:30-14:00	SMAP----Product design and solution for mobile payment applications Li Wei Technical Director, Shanghai Fudan Microelectronics Group Co Ltd [email protected]
14:00-14:20	Tea Break
14:20-14:50	Advanced Design Requirements in Legacy Processes Russell Lee PacRim Technical Director, Mentor Graphics Corporation slides download
14:50-15:20	Recent Trends in U.S. Patent Law  that Affect IC Industry Ningling Wang Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP slides download

Program Manager:
Mr. Kevin Wu
Tel:86.21.6027.8558
Email:[email protected]

Mr.Norman Cheng 
Tel:86.21.6027.8557
Email:[email protected]

Customer Service:
Mr. Norman Cheng
Tel:86.21.6027.8557
Email:[email protected]