IC Application from Design to Manufacturing
| Date: | Thursday, March 21, 2013 |
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| Time: | 08:30 – 15:20 | |
| Venue: | Function Room 3, Kerry Hotel Pudong, Shanghai(Shangri-La Group) | |
| Note: | Chinese and English Simultaneous Interpretation will be provided on-site. | |
Sponsored by:
Program Brief
Represented by ASMC, CSMC, SMIC, Hua Hong NEC and Grace, China local IC industry has been growing and expanding rapidly. In recent years, the gap between China and the rest of the world narrows signi cantly in terms of technology and design capacity. Volume production has been achieved at 90nm, 65nm, 45nm, and even 32nm process nodes. Meanwhile, IC design occupies nearly 20% market share of the whole industry. Local design and manufacturing supplement each other well and play a key role in the development of China IC Market.
Localization is certainly an irreversible trend, and China local IC industry is set to become a strong power in the future. As an industry association serving the whole supply chain for the microelectronic, display and photovoltaic industries, SEMI China will organize “The China Market: IC Design to Manufacturing” forum in conjunction with SEMICON China 2013.
Prestigious scholars and industry experts will discuss and address on China local IC industry status and future development. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scienti c information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.
Topics
10:30-11:00
Innovation & Partnership to Drive Success
13:00-13:30
RF Solution for 4G Smart Phones
13:30-14:00
SMAP----Product design and solution for mobile payment applications
Advanced Design Requirements in Legacy Processes Advanced Technology in IC Design and Manufacturing
Future IC Development Trend and Challenges
Current IC Manufacturing Technology for Telecom
IC in Wireless System
——IC Design in 3G: TD-SCDMA, WCDMA, CDMA2000
——IC Design in 4G: LTE, WiMax
——Network Processor
IC in Fixed Line System
IP Needed in Communication System
IGBT& Power Management IC
LED Driver
State-of-the-Art of EDA Tools
Who Should Attend
Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service
Agenda
Conference Host: TBD
8:30-9:00
Registration
9:00-9:10
Opening Remark
9:10-9:40
Advanced analog manufacturing Service
Weiping Zhou
VP of Advanced Semiconductor Manufacturing Corporation
yu_qing_lin@asmc.com.cn
9:40-10:10
Building China IC Manufacture Platform, Partnering for Success
Jyishyang Liu
Senior Vice President, Central Engineering & Services, Central Operations (Acting), SMIC
10:10-10:30
Tea Break
Tony Chen
President of Asia Pacific, Grace
11:00-11:30
Semiconductor Packaging Solutions in the Mobile World
Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai
http://www.aseglobal.com/en/
Jim Bao
Director of Engineering, RFMD, Inc
Li Wei
Technical Director, Shanghai Fudan Microelectronics Group Co Ltd
liwei@fmsh.com.cn
14:00-14:20
Tea Break
14:20-14:50
Russell Lee
PacRim Technical Director, Mentor Graphics Corporation
slides download
14:50-15:20
Recent Trends in U.S. Patent Law that Affect IC Industry
Ningling Wang
Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
slides download
Contact us:
Program Manager:
Mr. Kevin Wu
Tel:86.21.6027.8558
Email:kwu@semi.org
Mr.Norman Cheng
Tel:86.21.6027.8557
Email:ncheng@semi.org
Customer Service:
Mr. Norman Cheng
Tel:86.21.6027.8557
Email:ncheng@semi.org