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陈兴隆 沈阳芯源微电子设备有限公司，技术长 |
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专业领域/PROFSSIONAL PROFILE 长期从事半导体设备和器件领域的一线研究和开发，熟知半导体设备的完整PLC开发流程。曾在应用材料公司和三星电子生产技术研究所领导多个重量级研发项目，覆盖从可行性研究和立项直到产品发布。 Proven record of driving full PLC of complex semiconductor capital equipment development, led multiple high-impact R&D projects from initial concepts to successful high-value products at Applied Materials and Samsung Electronics. 在半导体设备工程，工艺流程，材料科学以及供应链管理方面具有丰富经验。 Extensive experience in semiconductor equipment engineering, processes, materials, and supply chain management. 在各种半导体设备的研发和制造方面具备坚实的理论和实践基础，包括 CVD/ALD，dry Etch，RIE, RTP, EPI/SEG, PVD, 光刻和清洗 track 设备等。在半导体设备工程的机械设计，流体流动控制，传热传质，射频和等离子体，真空以及系统集成方面具有强大的理论分析和动手实践能力。 Solid background in broad disciplines of semiconductor equipment engineering and manufacturing, including CVD/ALD, dry Etch, RIE, RTP, EPI/SEG, PVD, Photo and clean track equipment. Strong analytical and hands-on skill set in mechanical design, fluid flow, heat transfer, RF & Plasma, vacuum and system integration. 深入了解各种先进半导体器件（包括逻辑器件，DRAM和VNAND）的工艺流程以及设备要求，下一代器件技术和市场发展方向及其对未来设备研发的影响和要求。 Insight into advanced semiconductor device (including logic, DRAM, and VNAND) integration flow, emerging technologies and market directions, and their impact on future equipment development. 工作经验/Working experience
教育背景/Education background
摘要 / Speech summary 简单介绍芯源公司的历史沿革，公司现状和市场定位。主题内容为前道匀胶显影设备技术概况，业界动向和芯源公司全新前道设备的研发现状和技术特征 First briefly introduces the company history, status and market positioning of KINGSEMI Co., Ltd. Main topic for the speech covers a brief review of FEOL coating and developing equipment technology and industry trends, follows with the development status and technical features of the latest offering of FEOL track from KINGSEMI. |
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