(** to designate keynote talk, * to designate invite talk)
Sunday, March 11, 2018 Shanghai International Convention Center
Meeting Room: 5A
Session I: Front end CMP technology
Session Chair: Yuchun Wang
| **13:30-14:00 | CMP Challenges to Keep Up with Moore's Law |
| Gary Ding, Intel Corporation | |
| *14:00-14:25 | Middle of Line Contact for Advanced Node Semiconductor: from Tungsten to Cobalt |
| Stan Tsai, GLOBALFOUNDRIES, USA | |
| *14:25-14:50 | Defect control for high k metal gate CMP |
| Changhong Gong, Huali Microemectronics | |
| 14:50-15:15 | New CMP Processes Development and Challenges for 7nm and Beyond |
| Huang Haigou, GLOBALFOUNDRIES, USA | |
| 15:15-15:30 | Coffee Break |
Session II: Front end CMP consumables
Session Chair: Jingxun Fang
| *15:30-15:55 | ALD W metal gate CMP |
| Tao Yang, IME | |
| 15:55-16:10 | STI Scratch Defects Reduction by Using Solid PAD in 1x Technology Node |
|
Tuung Luoh, Macronix International Co., Ltd
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| 16:10-16:25 | Low scratch high throughput auto stop slurry |
| Jinfeng Wang, Cabot Microelectronics | |
| 16:25-16:40 | Characterization of Lanthanide Elements Doped Ceria Nanoparticles and Its Performance in Chemical Mechanical Polishing as Novel Abrasive Particles |
| Jie Cheng, Tsinghua University | |
| Poster Session: | Location: 5th Floor |
| Coffee Break | CMP PAD SURFACE UNIFORMITY OPTIMIZATION AFTER POLISH |
| Ying Lu, SMIC | |
| AMAT Reflexion® LK PrimeTM--- Flexible and Extendible CMP Platform | |
| Neil Zhong, AMAT | |
| Process Optimization for Multiple Wire Sawing of Semiconductor Material | |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| An Investigation into Semiconductor Wafer Surface Waviness in Chemical Mechanical Polishing | |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| Development of a Standard Evaluation System to Characterize and Quantify Pad Foam Morphology for Chemical Mechanical Polishing (CMP) | |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| Application of in-situ pad thickness profile control in WCMP | |
| Changxing Tan, Applied Materials |
Monday, March 12, 2018 Shanghai International Convention Center
Meeting Room: 5A
Session III: Backend, memory, and packaging CMP
Session Chair: Jin-Goo Park
| **8:30-9:00 | CMP Challenges for Interconnect Scaling |
| Donald F Canaperi, IBM | |
| *9:00-9:25 | CMP Challenges for Advanced Logic and Memory Device Manufacturing |
| Sidney Huey, Applied Materials | |
| *9:25-9:50 | CMP New Challenges in 3D NAND Era |
| Ke K. Wang, Intel Dalian | |
| *9:50-10:15 | CMP technology for advanced packaging |
| Haedo Jeong, Pushan University | |
| 10:15-10:30 | Study of Electro Kinetic-Force Assisted CMP of Glass Wafer |
| Chao-Chang Chen, National Taiwan University of Science and Technology | |
| 10:30-10:45 | Coffee Break |
Session IV: CMP equipment and metrology
Session Chair: David Huang
| *10:45-11:10 | Continuous Process Control for Metal CMP |
| Jianshe Tang, Applied Materials | |
| *11:10-11:35 | New CMP tool Development and Its Applications |
| Dewen Zhao, Tsinghua University | |
| *11:35-12:00 | From Confined Area to Wafer Level Nanotopography Metrology Solution for Process Developments |
| Tae-Gon Kim, IMEC | |
| 12:00-12:15 | INVESTIGATION OF EFFECTS OF PATTERN STRUCTURES ARRANGEMENT ON CHEMICAL MECHANICAL POLISHING PROCESS |
| Lixiao Wu, Lanzhou University of Technology | |
| 12:15-13:45 | Lunch Break |
Session V: CMP consumables
Session Chair: KC Wu
| *13:45-14:10 | Slurry Filtration for CMP Defect Improvement |
| David Huang, Pall and Anji | |
| *14:10-14:35 | Co-optimization of CMP Pad and Slurry for Overall Process Performance Enhancement |
| Robert Auger, Dow | |
| *14:35-15:00 | Colloidal Silica: Chemistry, Properties and Adaptations for Electronic Polishing Applications |
| Francois Batllo, Nalco | |
| *15:00-15:25 | Slurry development in sapphire,SiC, Si, and LiTaO3 |
| Weili Liu, Shanghai Institute of Microsystem and Information Technology | |
| 15:25-15:40 | Coffee Break |
Session VI: Process optimization and modelling
Session Chair: Xinchun Lu
| 15:40-15:55 | Novel CMP Pads by Special Structural Design |
| Min Liu, Hubei DingHui Microelectronics Materials Co.,Ltd | |
| 15:55-16:10 | A theoretical study of optimization for pad consumption in a CMP process |
| Ji Ming Jiang, Suzhou IV Technologies, Co.Ltd | |
| 16:10-16:25 | Analysis of Varied Pad Surfaces by Conditioners and Their Performance on RR and Defect in Oxide CMP |
| Yu-Hao Pan, Suzhou IV Technologies, Co.Ltd | |
| 16:25-16:40 | Highly Accurate Profile Control via Application of Multi-Zone Polish Head for 200mm Thin-Film SOI CMP |
| Mike Liu, Applied Materials | |
| 16:40-16:55 | 3M next Generation Filter in CMP Filtration |
| Garry Wang, 3M |