程卫华
长江存储，副总裁/联席首席技术官

个人简介

程卫华，现任长江存储科技有限责任公司联席首席技术官，负责3D NAND的技术研发。在加入长江存储前，就职于武汉新芯担任资深副总裁，负责工厂生产及技术研发项目。有超过27年半导体行业的经验，涵盖设备、工艺、工艺整合、研发和生产管理。先后参加过908工程建设，中芯国际建厂，中芯国际45nm/40nm的技术研发及导入量产。曾就读于浙江大学半导体物理与器件本科，新加坡国立大学微电子硕士。

摘要

3D NAND has rapidly become a standard technology for dynamic systems. However, with array stacking layers getting higher, traditional 3D NAND flash memory faces new challenges, such as CMOS/array thermal impact and topography issues, limited I/O speed, density, and cycle times. Meanwhile, NAND fab expansion brings manufacturing challenges including efficiency loss, slow learning, material waste, and unpredictable quality.

With innovative thinking and persistent efforts, YMTC provides both advanced 3D NAND solutions and smart manufacturing methods to make contribution to the industry. In this presentation, Weihua Cheng, co-CTO of YMTC will introduce how Xtacking technology solves such challenges and how to use big data analysis in smart manufacturing to meet increasing customer demands from smartphones, SSDs, and IoT applications.