|
(** to designate keynote talk, * to designate invite talk) |
Sponsored by: |
|
Meeting Room: 3B
Session I: Integration -- FEOL
Session Chair: Zhen Guo
| **13:30-14:00 |
3D hybrid scaling of CMOS for the next scaling era |
| Julien Ryckaert, IMEC | |
| *14:00-14:25 | Cobalt Electrofill for Future Generations of Contacts and Interconnects |
| Tighe Spurlin, Lam Research | |
| 14:25-14:40 | Difficulty involved to observe the surface smoothing effect of an amorphous high-k dielectric thin film deposited by atomic layer deposition on a metastable metal film |
| Wai Shing Lau, D. Li, H. Wong, S. Dong, Zhejiang University | |
| 14:40-14:55 | Surface smoothing and roughening effects of high-k dielectric materials deposited by atomic layer deposition and their significance for MIM capacitors used in DRAM technology |
| Wai Shing Lau, Zhejiang University | |
| 14:55-15:10 | An efficient method of wafer thermal uniformity improvement and wafer edge yield enhancement by utilizing backside film removing |
| Zhejun Liu, Peng Wang, Ran Huang, Ying Xu, Wei Zhou, Shanghai Huali Microelectronics Corporation | |
| 15:10-15:25 | Coffee Break |
Session II: Integration -- BEOL
Session Chair: Zhao Chao
| **15:25-15:55 | Integration Options for Enabling Fully Self Aligned Via |
| Gayle Murdoch, IMEC | |
| *15:55-16:20 |
DFI™: Detect the Undetectable with Design for Inspection |
| Klaus Schuegraf, PDF Solution | |
| 16:20-16:35 | Detect, Understand and Fix Starburst Defect at Via Litho Film Stacks |
| Zhiguo Sun, Eswar Ramanathan, Mary Claire Silvestre, Tingge Xu, Kripa Chauhan, Vijaya Rana, Joseph Shepard Jr, Vijayalakshmi Seshachalam, Minrui Wang, Anbu Selvam KM Mahalingam, Yang Bum Lee, Globalfoundries | |
Tuesday, March 19, 2019 Shanghai International Convention Center
Meeting Room: 3B
Session III: Thin Film -- FE / ALD
Session Chair: Beichao Zhang
| **8:30-9:00 | Advanced Ti-based silicides Ohmic contacts in sub-16/14 nm nodes |
| Dr. Jun Luo, IMECAS | |
| 9:00-9:15 | Press-fit Whisker and Its Growth Contributing Factors-Part I |
| Flora He, Dennis Chan, Crystal Li, Geoffrey Tong, Dennis Yee, Dow Electronic Materials | |
| Shuzhao Cao, Xi Cao, Huawei Technologies Co., Ltd. | |
| John Lehman, Amphenol ICC | |
| 9:15-9:30 | The effect of TiN cap layer thickness and N2 flow on threshold voltage and resistance in high-k metal gate integration |
| Cheng Liu, Meng Shi, University of Chinese Academy of Sciences | |
| Jianqiang Liu, Zirui Liu, Aiji Wang, Feng Shi, Semiconductor Manufacturing North China Corporation | |
| Haiyang Mao, Smart Sensing R&D Center, Institute of Microelectronics of Chinese Academy of Sciences | |
| 9:30-9:45 | Brief Introduction of Thermal Oxidation Technology |
| Yan Sun, Yanhua Wu, Kexue Liu, Wenfei Zhou, Beijing NAURA Microelectronics Equipment Co., Ltd | |
| 9:45-10:00 | The Study of Relation Between Temperature Distribution on Silicon Wafer with Gas Flow Rate and Temperature Ramp Rate |
| Kexue Liu, Yanhua Wu, Yan Sun, Yuanzhi Li, Wenfei Zhou, NAURA Technology Group Co., Ltd. | |
| 10:00-10:15 | Coffee Break |
Session IV: Thin Film -- BE / Plating
Session Chair: Huang Liu
| **10:15-10:45 | Alternative metallization for advanced interconnects |
| Dr. Christoph Adelmann, IMEC | |
| *10:45-11:10 | Direct Copper Damascene Fill on Cobalt Liner Structures |
| Lee Brogan, Lam Research | |
| *11:10-11:35 | Developments of Cu Barrier/liner Materials for 10nm CMOS Technology Node & Beyond |
| Dr. Xiaoping Shi, Naura | |
| *11:35-12:00 | BEOL Low-k Dielectrics for 5nm and below |
| Dr. Kang Sub Yim, AMAT | |
| 12:00-13:30 | Lunch Break |
Session V: New Technology -- New Device
Session Chair: Xiaoping Shi
| **13:30-14:00 | Advanced Nanoscale Magnetic Tunnel Junctions for Low Power Computing |
| Weisheng Zhao, Beihang University | |
| 14:00-14:15 | Properties of PVD AlN for LED applications |
| Bingliang Guo, Boyu Dong, Xuewei Wu, Xinying Li, Shubo Wu, Yilong Yang, Yujie Liu, Jiahao Zhang, Lu Zhang, Yujing Chen, Chenguang Zhao, Yinggong Ma, Xiaoping Shi, Hougong Wang, Peijun Ding, Beijing NAURA Microelectronics Equipment Co., Ltd. | |
| 14:15-14:30 | Preparation and thermochromic properties of W-VO2@SiO2 nanospheres array for smart windows |
| Liwei Zhou, Ming Hu, Xiaoyong Qiang, Tianjin University | |
| 14:30-14:45 | Synthesis of WSe2 by Chemical Vapor Deposition and Influence of Hydrogen on Morphology |
| Xichao Di, Fang Wang, Junqing Wei, Baojun Zhang, Xin Lin, Kailiang Zhang, Tianjin University of Technology | |
| 14:45-15:00 | Improved surface acoustic wave characteristics of c-axis oriented AlN films with ZnO buffer layer |
| Shuo Yan, Fang Wang, Kaifei Dong, Meng Deng, Yujie Yuan, Yinping Miao, Kailiang Zhang, Tianjin University of Technology | |
| 15:00-15:15 | Improved rapid Ammonia sensor based on Ag modified Silicon Nanowires incorporated with Pd Nanoparticles |
| Xiaoyong Qiang, Tianjin University | |
| 15:15-15:30 | Coffee Break |
Session VI: New Technology -- New
Session Chair: Larry Zhao
| 15:30-15:45 | A New Differential Pressure Based Mass Flow Controller for Advanced Semiconductor Processing | ||
| Mohamed Saleem, Alexandra Liso, Anthony Kehoe, Brooks Instrument | |||
| 15:45-16:00 | Mechanisms for PFC Formation in CVD Applications | ||
| Ma Zhen, Prof. Mike Czerniak, Edwards Technologies Trading (Shanghai) Co.,Ltd | |||
| 16:00-16:15 | Comprehensive Study of Interfacial Charges in the GEOX/AL2O3 Gate Stack of GE by Ozone Oxidation | ||
| Lixing Zhou, Chao Zhao, Tianchun Ye, Wenwu Wang, Institute of Microelectrics of Chinese Academy of Science, University of Chinese Academy of Sciences | |||
| Xiaolei Wang, Jinjuan Xiang, Institute of Microelectrics of Chinese Academy of Science | |||
| 16:15-16:30 |
Plasma Process Optimization of Silicon Film Deposition from trichlorosiliane precursor with OES Monitoring |
||
| Chien-Chieh Lee, Song-Ho Wang, Hsueh-Er Chang, Yiin-Kuen Fuh, Tomi T. Li, National Central University | |||
| Ya-Hui Chiou, Hsin-Chuan Cheng, Shihlien Fine Chemicals Co., Ltd | |||
| Poster Session: | Location: 5th Floor | ||
| Coffee Break | Study of spacer formation in FDSOI technology | ||
| Yang Song, Kang Ye, Changfeng Wang, HLMC | |||
| RF PVD -Bottom Coverage and Overhang Improvement for HAR contact | |||
| Qingjun Ni, Aileen Kang, Lei Zhu, Applied Materials | |||
| Cu Barrier & Seed Integration for Advanced Copper Interconnection | |||
| Qingxia Fan, Guilong Wu, Qingshan Zhang, Jian Kang, Applied Materials China | |||
| Extending PVD Cu Barrier & Seed to the 10nm Node and Beyond | |||
| Qingxia Fan, Guilong Wu, Qingshan Zhang, Jian Kang, Applied Materials China | |||
| Integrated Circuit Back End of Line Defect Detection | |||
| Wang Wei, Zhu zhenhua, SMIC | |||
| Fabrication of Flexible Surface Acoustic Wave Devices Based on Aluminum Nitride | |||
| Meng Deng, Fang Wang, Kaifei Dong, Dianyou Song, Shuo Yan, Kailiang Zhang, Tianjin University of Technology | |||
| Study of Glue Layer Anneal Impact on W Contact Void Mitigation | |||
| Qinggang Zhou, Chenyu Wang, Ganming Zhao, Applied Materials | |||
| Specific Solution to Extend Anneal System Productivity | |||
| Guangyao Shen, Qinggang Zhou, Chenyu Wang, Applied Materials | |||
| Atomic Layer Deposition TaN Barrier Application in BEOL Cu Interconnection | |||
| Guilong Wu, Liechao Luo, Qingshan Zhang, Qingxia Fan, Jian Kang, Applied Materials China, Shanghai, China | |||
| AMAT Metal Deposition Product for 28nm Metal Gate Integration Solution | |||
| Qingshan Zhang, Guilong Wu, Qingxia Fan, Jian Kang, Applied Materials China | |||
| Contact Resistance Improvement by TaN/Ta Integration | |||
| Qingshan Zhang, Guilong Wu, Qingxia Fan, Jian Kang, Applied Materials China | |||
| APF 550 defect reduction | |||
| Xiang Li, Applied Materials | |||
| Improve the Performance of Metal Contamination of HDP | |||
| Xiang Li, Applied Materials | |||
|
Interfacial Study for Enhanced AlN/ODC Stack Film Application in Advanced Nodes |
|||
| Cesar Ji, Lam Research | |||
|
Factors Affecting Peeling Defects from PECVD A-Si Film on Silicon Oxide Substrate |
|||
| Zhengyang Liu, Lam Research | |||