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Jianmin Li 李健民 Packaging R&D Director封装技术开发总监 Amkor Assembly & Test (Shanghai) Co., Ltd. 安靠封装测试（上海）有限公司 |
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个人简介 / Biography Jianmin Li, packaging RnD director in Amkor Assembly & Test (Shanghai) Co. Ltd, he and his team develop various package type including memory SCSP, flip chip package, SiP and sensor packages, and which have been moved to mass production for tier1 and local customers. He has more than 20 years of experience in assembly process engineering area. He holds a Master degree in Material Engineering from Fudan University. 摘要 / Abstract Memory packaging technology • Memory market trend • 3D NAND packaging technology • Amkor solutions |
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