Symposium Chair: Prof. Xinping Qu, Fudan University, China
| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Monday, March 24, 2025 Shanghai International Convention Center
Meeting Room:
Session I: CMP
Session Chair: Xinping Qu
| 13:30-13:35 | Opening Remarks |
| **13:35-14:05 | Grinding and Chemical Mechanical Polishing Applications in Advanced Packaging |
| Xinchun Lu, Hwatsing Technology Co.,Ltd | |
| *14:05-14:30 | Analysis of thermal effects in chemical mechanical planarization (CMP) |
| Taesung Kim, Sungkyunkwan University | |
| *14:30-14:55 | Application of ultra-low SG hard pad in CMP |
| Yijie Luo, Hubei Dinglong Co.Ltd. | |
| 14:55-15:10 | Backside Chipping improvement Study On Hybrid Bonding Process |
| Liang Tian, Semiconductor Manufacturing North China ( Beijing ) Corp | |
| 15:10-15:25 | A Novel Dynamic Hypergraph Attention Framework for The Prediction of Removal Rate in Chemical Mechanical Polishing Process |
| Jie Cheng, China University of Mining & Technology-Beijing | |
| 15:30-17:00 | Poster Session |
Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room:
Session II: CLEANING and POST CMP CLEANING
Session Chair: Jingxun Fang
| *09:00-09:25 | Challenges and Solutions of Wet Processes in Semiconductor Manufacturing |
| Zhiyong Xie, Beijing NAURA Technology Group Co., Ltd. | |
| *09:25-09:50 | The compression deformation and particles removal of PVA brushes during the post-CMP cleaning process |
| Shu Yang, ACM | |
| *09:50-10:15 | Post Metal CMP Cleaning Technology Processes and Materials |
| Guanghong Luo, Yantai Xianhua Polymer Materials Ltd. | |
| 10:15-10:30 | Experimental Investigation of Physical Cleaning Using Supercritical CO2 on Contaminated Substrates |
| Dayoung Yu, Sungkyunkwan University | |
| 10:30-10:45 | Coffee Break |
Session III: METAL CMP
Session Chair: Jie Cheng
| *10:45-11:10 | Improvement of W CMP Erosion Defect and Planarization Performance |
| Yu Yao, Semiconductor Technology Innovation Center (Beijing) Corporation | |
| 11:10-11:25 | RTPC X Pre-Thickness Control Function on Metal CMP Layer |
| Mingtao Luo, Applied Materials | |
| 11:25-11:40 | Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ru Based Copper Interconnects |
| Zheng Wu, Hebei University of Technology | |
| 11:40-13:30 | Lunch Break |
Session IV: Dielectric CMP
Session Chair: Baoguo Zhang
| *13:30-13:55 | Uniformity and Defect Improvement in Dielectric CMP with Pad Dressing Optimization |
| Yu Yang, Shanghai Huali Integrated Circuit Corporation | |
| *13:55-14:20 | Retaining Ring Waer Study with Ceria Slurry for Chemical Mechanical Planarization |
| JialiangHuang, Anji Microelectronics Technology (Shanghai) Co., Ltd. | |
| 14:20-14:35 | Mesoporous CeO2 Particle Abrasives with High Specific Surface Area for Enhanced Chemical Mechanical Polishing Performanc |
| Wei Yuan, Inner Mongolia University | |
| 14:35-14:50 | FullVision Endpoint System Application on Thick Dielectric Film CMP Uniformity Control |
| Weihan Zhu, Applied Materials | |
| 14:50-15:05 | Coffee Break |
Session V: COMPOUND CMP
Session Chair: Shoutian Li
| 15:05-15:20 | Use Damascus CMP to fabricate IGZO transistor in advanced Dram technology |
| Ming Zeng, Beijing Superstring Academy of Memory Technology | |
| 15:20-15:35 | Effect of Surfactants on the Properties of C-, A- And M-Plane Sapphire CMP |
| Bin Hu, Hebei University of Technology | |
| 15:35-15:50 | Study on the efficiency enhancement of chemical mechanical polishing of gallium nitride by acetic acid |
| Wenhao Xian, Hebei University of Technology | |
| 15:50-16:05 | Study on the enhancement of surface quality of polyimide films by chemical mechanical polishing |
| Yafei Yin, Hebei University of Technology | |
| 16:05-16:20 | A wafer-level CMP multi-physics modeling for IC manufacturing |
| Zhiwei Zhang, Zhejiang University |
| Poster Session: | |
| Impact of Carrier Lining Structure on the Wafer Edge Stress in Chemical Mechanical Double-Sided Polishing | |
| Yiran Liu, Shanghai Institute of IC Materials | |
| Study on the removal rate and electrochemical corrosion of titanium in chemical mechanical polishing | |
| Ziyi Cao, Hebei University of Technology | |
| 22 AL gate change W gate improve for NMOS performance | |
| Yanhua Cai, Shanghai Huali Integrated Circuit Corp. | |
| The Novel Strategy of Pattern Gate High Loading Controlling in ILD0 CMP Process | |
| Shuxiang Wang, Shanghai Huali Integrated Circuit Corp. | |
| Application and Improvement of CU CMP Thickness Control Method Based on R2R System | |
| Cheng Liu, Shanghai Huali Integrated Circuit Corp. | |
| Study of Metal Film Thickness on Endpoint Detection in Chemical Mechanical Polishing (CMP) | |
| Cheng Liu, Shanghai Huali Integrated Circuit Corp. | |
| Improvement of Polishing Fluid for Copper Targets by Polyethylene Glycol | |
| Jiangtao Qiang, Hebei University of Technology | |
| Study on the influence of surfactant concentration on the planarization effect of quartz wafers | |
| Zian Ba, Hebei University of Technology | |
| Effect of H2O2 on Poly Silicon Chemical Mechanical Planarization Particle Defect | |
| Chenchen Yang, Semiconductor Technology Innovation Center (Beijing) Corporation | |
| Application and mechanism research of novel green chelating agent in CMP | |
| Lijun Dong, Hebei University of Technology | |
| Hybrid Bonding Cu CMP Process Development | |
| Yongbin Wei, Applied Materials | |
| Investigation of Fe-Complex Catalysts in Tungsten Chemical Mechanical Polishing (CMP) with Passivation Layer Formation and Hydroxyl Radical Generation | |
| Hyunho Kim, Sungkyunkwan University | |
| Effect Of Green Surfactant ADS On Properties Of COPPER CMP SLURRY | |
| Jiahui Li, Hebei University of Technology | |
| Pad physical properties Effects on Removal Rate in a STI Ceria CMP Process | |
| Jitao Chen, Shanghai Huali Integrated Circuit Corporation | |
| Study On the Relationship Between Transmittance and Polish Time | |
| Wangbing Li, Shanghai Huali Integrated Circuit Corporation | |
| Ebara Tungsten CMP process defect improvement | |
| Tian Ding, Shanghai Huali Integrated Circuit Corporation | |
| N28 Tech Node Metal CMP Profile Uniformity and Defectivity Improvement by RTPC-X MPC and JMP DOE Analysis | |
| Likun Cheng, Applied Materials | |
| RTPC X and RTPC XE application on Cu CMP | |
| Yifeng Zheng, Applied Materials | |
| Innovative Process Development on Wafer Quality & Throughput in SiC CMP | |
| Zhenxing Song, Applied Materials | |
| STI CMP Uniformity Improvement by WIW iAPC | |
| Yuan Li, Applied Materials | |
| CU CMP 65nm intermetal residue issue solution | |
| Ben Gu, Applied Materials | |
| Improvement of UTM CU CMP Profile Uniformity by RTPC-X Endpoint System | |
| Mingzheng Han, Applied Materials | |
| 28nm SOI Tungsten CMP HDF step low range of post thickness achieved by RTPC X | |
| Wanli Xing, Applied Materials | |
| Accurate Profile Control of CMP Pad During Polishing Process | |
| Yanjun Yu, Applied Materials | |
| A Novel Cu Barrier CMP Process Tuning Study for Throughput Improvement | |
| Jiaming Xu, Applied Materials | |
| Excellent Particle Performance with Brush Gap Optimization in Wafer House CMP Process | |
| Qiang Chen, Applied Materials | |
| Poly CMP Surface Particle Improvement CIP | |
| Tao Ni, Applied Materials | |
| 28HKMG STI inline performance improvement with FVXE application in | |
| Mengyao Liu, Applied Materials | |
| LK Defect improvement CIP in high-end wafer house product | |
| Siyuan Pang, Applied Materials | |
| Study on Chemical Mechanical polishing efficiency of single Crystal AlN by different abrasives | |
| Shitong Liu, Hebei University of Technology | |
| FullVision™ NIR Endpoint for Si CMP TTV improvement | |
| Haodong Huang, Applied Materials | |
| The Effective Method of Cu Defect Improvement with New CIP Head Wash Nozzle | |
| Mengxia Li, Applied Materials | |
| OX and Cu selectivity Investigation on Cu CMP | |
| Kun Zhang, Applied Materials | |
| HPPC Close Loop Control for FEOL CMP Process Stability and Productivity Improvement | |
| Na Xiao, Applied Materials | |
| New optimized method to Slurry Arm for Metal RR NU Improvement | |
| Weiguo Wang, Applied Materials | |
| Cu defect improvement with BB2.0 function | |
| Kewen Wang, Applied Materials | |
| Cu IM CMP Rs Control Capability Improvement | |
| Youlai Xiang, Applied Materials | |
| Ceria Polishing Abrasives with Enhanced Dispersion Stability Across Wide pH Range | |
| Junjie Xue, Inner Mongolia University | |