Symposium Chair: Prof. Jianshi Tang, Tsinghua University, China
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to designate regular talk - 20 min |
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Sunday, March 17, 2024 Shanghai International Convention Center
Meeting Room: 5A
Session I: Emerging materials and devices
Session Chair: Jianshi Tang, Tsinghua University
| 13:30-13:35 | Opening Remarks |
| *13:35-14:05 | Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology |
| Gong Xiao, National University of Singapore, Singapore | |
| *14:05-14:35 | Heterogeneous Integration XOI materials and devices |
| Xin Ou, Shanghai Institute of Microsystem and Information Technology, China | |
| *14:35-15:05 | Si based GeSn materials and devices |
| Chuanbo Li, Minzu University of China, China | |
| 15:05-15:20 | Coffee Break |
| *15:20-15:50 | Antimonide semiconductor material for infrared sensing |
| Donghai Wu, Institute of Semiconductors, China | |
| *15:50-16:20 | Lamb Acoustic Wave Devices: Ready for Prime Time Applications and Challenges? |
| Songbin Gong, Spectron Tech, C4hina/UIUC, USA | |
Monday, March 18, 2024 Shanghai International Convention Center
Meeting Room: 5A
Session II: 2D materials
Session Chair: Wei Wang, Peking University
| 08:30-08:35 | Opening Remarks |
| *08:35-09:05 | Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures |
| Libo Gao, Nanjing University, China | |
| *09:05-09:35 | Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices |
| Lihong Bao, Institute of Physics, Chinese Academy of Sciences | |
| *09:35-10:05 | NOEMS based on vdW heterostrucutres |
| Zheng Han, Shanxi University, China | |
| 10:05-10:20 | Coffee Break |
| *10:20-10:50 | High-mobility 2D P-type semiconductor materials |
| Xiang Chen, Nanjing University of Science & Technology, China | |
| *10:50-11:20 | Universal Materials and Device Integration Technology for Future Chips |
| Chen Wang, Tsinghua University, China | |
| 11:20-11:40 | A Graphene Field Effect Transistor (GFET) based Integrated Biosensor System For Point-Of-Care Application |
| Ziyang Zhu, Fudan University, China | |
| 11:40-13:30 | Lunch Break |
Session III: MEMS & Sensors
Session Chair: Chen Wang, Tsinghua University
| 13:30-13:35 | Opening Remarks |
| *13:35-14:05 | A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q |
| Jinling Yang, Institute of Semiconductors, Chinese Academy of Sciences | |
| *14:05-14:35 | MEMS Acoustic Device |
| Songsong Zhang, Chengdu Xiansheng Technology/SITRI, China | |
| *14:35-15:05 | Advanced spectral sensing methods for process monitoring applications |
| Ray Saupe, Fraunhofer ENAS, Germany | |
| 15:05-15:30 | Coffee Break |
| 15:30-15:50 | TSV INTEGRATED and Pattern Recognition based Multimode Degenerated Low-power 3-dimensional Smart sensing chips |
| Simian Zhang, Tsinghua University, China | |
| 15:50-16:10 | SPAD-based line sensor IC for chemiluminescence assays in microfluidic channels |
| Alexander Zimmer, X-FAB Global Services GmbH, Germany | |
| 16:10-16:30 | Newly developed low-reflectivity black resist with high optical density |
| Hiroaki Idei, FUJIFILM Corporation, Japan | |
| 16:30-16:50 | UV-C Light Detection with High Performance Photodiodes Integrated in a 0.18 µm Modular CMOS Foundry Technology |
| Daniel Gäbler, X-FAB Global Services GmbH, Germany | |
| Poster Session: | |
| Design and experiment of a micro planar linear motor equipped with electromagnetic guide | |
| Chao Zhi, Shenzhen Technology University, China | |
| The performance enhancement of CMOS microbolometer with metal-insulator-metal-based plasmonic metamaterial absorbers | |
| Jie Liu, Nanjing University, China | |
| Performance-enhanced CMOS polysilicon microbolometer with narrow supporting arms | |
| Wenbin Zhou, Nanjing University, China | |
| Design of arbitrarily polarized CMOS terahertz detector based on plasmonic antenna | |
| Ke Wang, Nanjing University, China | |
| Investigation of electrical characteristics of a fabricated IGAD detectors at high and low temperatures | |
| Yupeng Lu, Institute of Microelectronics, China | |
| Research on stereo tactile simulation based on microelectrical osmotic pump technology | |
| Li Zheng, Hefei Visionox Technology Co., Ltd, Kunshan Branch, China | |
| An Intelligent General-Purpose Circuit and System for Broad Sensor Array-Based Applications | |
| Junye Li, Shenzhen University, China | |
| Colloidal quantum dot enhanced short-wavelength infrared absorption of avalanche photodetectors | |
| Lilei Hu, Shanghai University, China | |
| A novel multiple guard ring design for low dark current of backscattered electron detectors | |
| Lilei Hu, Shanghai University, China | |
| A Thin Film Cantilever-Based Magnetoelectric Magnetic Field Sensor and Energy Harvester Utilizing the Delta-E Effect | |
| Yuxi Wang, ShanghaiTech University, China | |