Symposium Chair: Prof. Jianshi Tang, Tsinghua University, China
| ** | to designate invited talk - 30 min | |||
| * | to designate regular talk - 25 min |
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Monday, March 24, 2025 Shanghai International Convention Center
Meeting Room: TBD
Session I: MEMS
Session Chair: TBD
| **13:30-14:00 | TBD |
| Yunchun Yang, Sai Microelectronics Inc. | |
| *14:00-14:25 | Integrated Fabrication and Applications of MEMS Devices on Ultra-thin Cylindrical Substrate |
| Zhuoqing Yang, Shanghai Jiao Tong University | |
| *14:25-14:50 | Smart Micro-Electromechanical and Nano-Photonic Devices Enabled by a Phase Transition |
| Kaichen Dong, Tsinghua Shenzhen International Graduate School, Tsinghua University | |
| *14:50-15:15 | Nanoelectromechanical Switches for Energy-Efficient Logic |
| Jinchi Han, Peking University | |
| 15:15-15:30 | Coffee Break |
Session II: Emerging Memory
Session Chair: TBD
| *15:30-15:55 | Applications and Challenges of Voltage-Controlled Magnetic Anisotropy (VCMA) |
| Albert Lee, Inston Tech. | |
| *15:55-16:20 | Embedded MRAM and Support Circuitry Design Considerations |
| Hao Cai, Southeast University | |
| *16:20-16:45 | Highly Reliable RRAM Technology Development for Advanced Tech Node |
| Xiangchao Ma, Beijing InnoMem Technologies Co., Ltd | |
| 16:45-17:00 | Investigation of Selector Characteristics for Scalable 1S1R Array |
| Gaoqi Yang, Peking University |
Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room: TBD
Session III: Sensors
Session Chair: TBD
| **08:30-09:00 | Sensing and reliability design in commercial airspace industry |
| Zhikang Lan, Nanjing Gova Technology Co., Ltd | |
| *09:00-09:25 | IC and MEMS application in gas sensors |
| Anbo Guo, Semeatech Technology Co., Ltd. and Promisense Electronic Co., Ltd | |
| *09:25-09:50 | Chip tech for life science and medicine |
| Chang Chen, Shanghai Jiao Tong University, China | |
| *09:50-10:15 | Wearable ultrasound technology for deep-tissue monitoring |
| Hongjie Hu, Peking University | |
| *10:15-10:40 | Metal Oxide Based Heterostructured Nanomaterials Prepared by ALD for Effective Gas Sensors |
| Hong-Liang LU, Fudan University | |
| 10:40-10:55 | Coffee Break |
Session IV: Advanced Fabrication and Packaging
Session Chair: TBD
| *10:55-11:20 | Advancing material innovations to seamlessly integrate flexible sensors with rigid chips |
| Yuqing Zheng, Peking University | |
| *11:20-11:45 | Hybrid Laser Manufacturing of Flexible and Conformal Electronics |
| Kaichen Xu, Zhejiang University | |
| 11:45-12:00 | APF as a capping layer in post-implantation high temperature anneal process for SiC MOSFET |
| Zhuo Xiong, Applied Materials | |
| 12:00-12:15 | Coors-V Packaging Technology |
| Shujin Zhang, Shanghai YIBU Semiconductor | |
| 12:15-13:30 | Lunch Break |
Session V: 2D Materials and Applications
Session Chair: TBD
| **13:30-14:00 | Neuromorphic vision sensor |
| Shi-Jun Liang, Nanjing University | |
| *14:00-14:25 | Energy Intelligent Computing Devices Based on 2D Materials |
| Heejun Yang, Korea Advanced Institute of Science and Technology | |
| *14:25-14:50 | Computational Design of Sustainable 2D Semiconductors, Interfaces and Devices |
| Yeesin Ang, Singapore University of Technology Design | |
| *14:50-15:15 | Integration of 2D semiconductor based transistors for advanced logic nodes |
| Yuanyuan Shi, University of Science and Technology of China | |
| 15:15-15:30 | Coffee Break |
Session VI: Novel Computing & Sensors
Session Chair: TBD
| *15:30-15:55 | Functional Memristor for Biomimetic Sensory Computing |
| Suting Han, The Hong Kong Polytechnic University | |
| *15:55-16:20 | 3D micro-/nano-fabrication for high performance nanophotonics and sensors |
| Faheng Zang, Shanghai Jiao Tong University | |
| *16:20-16:45 | Multi-dimensional materials integration for smart sensor chips |
| Chen Wang, Tsinghua University | |
| 16:45-17:00 | Impact of Dielectric Environment and Thickness on MOS2 CVD Growth |
| Qiuxia Lu, University of Science and Technology of China | |
| Poster Session: | |
| Read Ff Performance Improvement by the Process Optimization in 4Xnm Etox Nor Flash Non Self-Aligned Fg Technique | |
| Chun Yao, Hua Hong Semiconductor (Wuxi) Limited | |
| A Design Structure of Three Axis Mems Accelerometer with Low Cross-Axis Sensitivity | |
| Qing Xie, Fudan University | |
| Advanced Stealth Metasurfaces: A Bidirectional ANN-Driven Design Methodology | |
| Pengfei Zhang, Southeast University | |
| Possibility of Channeling Implant Application in SiC Trench MOSFET | |
| Zhibo Zhang, Applied Materials | |
| White-Pixel Performance Improvement on CIS VIISta Trident Application | |
| Liangcong Du, Applied Materials | |