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Dr.Jing Zhang 张靖 Heraeus Materials Technology Shanghai Ltd, Head of Shanghai Innovation Center, Heraeus Electronics China 上海贺利氏工业技术材料有限公司，贺利氏电子中国研发总监 |
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讲师简介 / Speaker Bio Dr. Jing Zhang, head of Shanghai Innovation Center, Heraeus Electronics China, graduated from Delft University of Technology. His research of interests includes power electronic packaging material, process and reliability. In 2017, he joined Heraeus, focusing on advanced packaging and reliability evaluation for the WBG semiconductor devices. He has published 20 papers, authored 1 academic work. Dr. Zhang is the Founding Chairman of IEEE Electronics Packaging Society (EPS) Benelux Branch, the Executive Secretary of the International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW). He also serves as a member of the Technical Committee of the Center for Shanghai Silicon Carbide POWER Devices Engineering & Technology Research. He is an off-campus supervisor of master’s students at Fudan University and Shanghai Jiaotong University. |
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