Somit Joshi
Sr. Director of Marketing in Veeco

Biography

Somit Joshi heads marketing and product management of MOCVD systems for Power and RF applications.

Over 20 years career he has performed a variety of leadership roles with broad expertise in P&L management, marketing, product development, product differentiation, customer support, and complex project management. Considerable experience working with geographically dispersed teams, international projects and successful management of cross-functional programs. Currently, as Sr. Director of Marketing, MOCVD, Veeco Corporation, he heads the marketing effort for Veeco’s Single Wafer Reactor (SWR) product line. Before Veeco, Somit gained extensive experience in creating and executing product and business strategies in the semiconductor market for KLA-Tencor in Milpitas, Ca.

He completed his graduate studies from University of Central Florida & Southern Methodist University and his Bachelor of Science in Engineering from IIT (Indian Institute of Technology) in India.

Abstract

Power & RF Electronics commercialization through MOCVD advancements from Single Wafer Reactor technology

Emerging mid and high voltage applications in consumer power supplies, alternate energy and data centers are requiring improved power efficiencies, higher operating frequencies and system size reductions. For RF applications (e.g. 5G), GaN is ideally suited due to its higher power capability relative to GaAs. Also GaN-Si RF devices provide a path to desired cost targets for 5G mobile handsets. However producing these devices in volume at line yields, reliability and cost targets requires GaN-Si MOCVD to rise to the next level. The MOCVD process has to deliver not just superior film quality but also a very tight wafer to wafer and run to run control, low defectivity and high uptime. In response to these high volume production requirements, Veeco has developed the next generation MOCVD system based on single wafer architecture. The single wafer architecture delivers very repeatable film performance over 10X longer campaigns over batch tools, resulting in superior final CoO for all wafer sizes. In this talk we will discuss these results as relevant to high volume production requirements.