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March 14-16,2018
Shanghai New International Expo Centre

Thomas Bondur

Thomas Bondur
Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research

Biography

Tom Bondur is corporate vice president of Advanced Packaging and MEMS/IoT Businesses at Lam Research. Mr. Bondur is responsible for representing Lam Research as the business executive in high level customer interactions, defining specific market requirements for Lam to be a leader in these markets, and developing business strategies that accelerate Lam’s growth in the Advanced Packaging and “more than Moore” equipment market opportunities. He brings over 20 years of high-tech and semiconductor experience to this role. Mr. Bondur returned to Lam Research following three years at Cymer, an ASML company, where he was leading Global Sales and Field Operations. From 2001 to 2011, Mr. Bondur held various positions at Lam Research including vice president of Business Development, vice president of Global Sales, and vice president of Global Field Operations. Previously, he was at Applied Materials in Santa Clara, CA and Meylan, France where he was in Sales, Business Management, and Process Engineering roles. Mr. Bondur holds a B.S. degree in business from the State University of New York.