为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

E. Jan Vardaman

E. Jan Vardaman
President of TechSearch International, Inc.

Biography

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

Abstract

Packaging for DRAM is at an inflection point. Dominated by wire bond interconnect in the last several decades, performance demands are driving the adoption of flip chip interconnect for some segments of the DRAM market. What are these new drivers and how do they impact the industry? This presentation describes the drivers for new packaging developments and highlights the changes that are taking place in the industry. This presentation discusses package trends in applications including mobile and high-performance computing and networking.