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March 14-16,2018
Shanghai New International Expo Centre

Dr. John Reid

Dr. John Reid
Novellus

Jonathan Reid, Ph.D., has been a Process Development Manager, Principle Engineer, and Fellow at Novellus Systems and Lam Research responsible for damascene copper electroplating process chemistry and hardware development used on the Novellus Sabre electroplating tool since 1996.

Prior to joining Novellus Systems Dr. Reid was employed at IBM from 1983 until 1996. During this time, Dr. Reid carried out plating process development activities in support in packaging, printed circuit board, and integrated circuit applications.

He received a Ph.D. in Analytical Chemistry/Electrochemistry from the University of North Carolina at Chapel Hill in 1983. Dr. Reid has published or presented over 100 papers and book chapters and has been issued 75 US patents.