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March 14-16,2018
Shanghai New International Expo Centre

Dr. Mark Huang

Dr. Mark Huang
SuZhou Speed Semiconductor, China

Mark Huang holds Ph.D. degree in Polymer Chemistry from The Institute of Chemistry, Chinese Academy of Science. He was a Postdoctoral Fellow at National University of Singapore from 1996 to 1998. He was a Material Engineer at Yizheng Chemical Fiber Company, Jiangsu, China from 1991 to 1993, a Senior Process Engineer at Hitachi Chemical Asia/Pacific, a Principal Engineer at Micron Semiconductor Asia from 2001 to 2008 and a Principle Member of Technical Staff at StatschipPAC and Institute of Microelectronics from 2009 to 2010 and Director of Technology Development at SFS Group-Unisteel Technology Group Company from 2011 to 2014. Dr. Huang joined Suzhou Speed Semiconductor Technology recently as CTO being in charge of TSV fabrication and application in SiP and MEMS packages.

He expertises in IC packaging materials (underfill, encapsulants, die-attach film/paste etc) and has been a key technical contributor to the R & D and implementation of advanced assembly technologies inclusive of Flip Chip in Package (FCIP), System in Packaging / Multi Chip Package (SiP/MCP), Wafer Level Chip Scale Package (WLCSP), Cu-Pillar Interconnection, Through Silicon Via (TSV), Untra-thin Wafer Processing and Cost-viable packaging solutions. He has published over 50 technical papers and holds 50 U.S. patents and 1 Singapore patent. His research interests include 3D-IC integration, TSV fabrication and assembly as well as materials-oriented research and development.