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March 14-16,2018
Shanghai New International Expo Centre

Dr. Daniel Lu

Dr. Daniel Lu
Henkel

Dr. Daniel Lu is the Vice President of Product Development and Technical Customer Service of the Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (AZ, USA), as a Sr. Scientist for 7 years. He also had worked for Lucent Technologies, Amoco’s Electronics Materials Division, and the Electronics Materials Group of National Starch and Chemical Company before. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, Intel Divisional Recognition Awards in 2002, 2003, and 2007, Intel most patent granting of the year for 2006 and 2007. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of the book “Materials for Advanced Packaging (2008)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development short courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu is a member of CMPT Board of Governor Member-at-large.