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March 14-16,2018
Shanghai New International Expo Centre

Scott Sikorski

Scott Sikorski
Vice President of Group Technology Strategy & Product Technology Roadmap for JCET Group

Biography

Dr. Scott Sikorski joined STATS ChipPAC in 2009 after a 20 year career with IBM Microelectronics during which time he held positions related to semiconductor packaging in R&D, Manufacturing, Product Line Management, Business Management, and Marketing. Upon joining STATS ChipPAC, Dr. Sikorski was responsible for the Wirebond and Test product line areas. He is the Vice President of Group Technology Strategy and is now working on the product technology roadmap for JCET Group. Dr. Sikorski received his Bachelor of Science degree from Columbia University’s School of Engineering and Applied Sciences in Metallurgical Engineering and his Master’s degree and Ph.D. from the Massachusetts Institute of Technology, both in Materials Engineering.