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March 18-20, 2020
Shanghai New International Expo Centre

Dr. Tianniu (Rick) Chen

Dr. Tianniu (Rick) Chen
Vice President of Global SP&C, Versum Materials

Biography

Dr. Tianniu (Rick) Chen is the Vice President of Global SP&C (Surface Preparation & Cleans) SBU (Sub Business Unit) of Versum Materials (VM) and is responsible for the overall profit and loss and strategies of its. He is based out of Taipei, Taiwan in Republic of China (ROC) now. Prior to his current appointment at VM (former Electronics Materials Division (EMD) of Air Products and Chemicals (APCI)), Rick held positions as a global business technology manager and the global business marketing director in EMD of APCI since 2014. Right before joining APCI, Rick was the manager of a global R&D team at the former Hi-tech division of Sigma Aldrich, now a part of Merck KGaA. Before that, Rick held a variety of technical and managerial positions in global R&D organizations at former Advanced Technology Materials, Inc. (ATMI), now a part of Entegris.

Rick received his B.S. in organic chemistry and M.S. in super-molecular chemistry both from Nanjing University in P. R. China. Rick then went on to receive his PhD in Organometallic/Materials Chemistry from the University of Tennessee (Knoxville) in the U.S. In addition, Rick is the author of more than forty peer-reviewed publications and the inventor of over twenty issued patents. Furthermore, Rick has been the invited reviewers for Materials Chemistry and Physics, & Microelectronic Engineering, both of which are Elsevier Journals. In addition, Rick has served in the SEMI materials committee in Taiwan since 2016 and SPCC (Surface Preparation and Cleaning Conference) technical committee since 2018.

Abstract

The development of formulated cleans for enabling packaging processes

Packaging processes have been recognized as and developed into viable approaches to enable the continuous scaling of devices together with improvements of costs and reliabilities of theirs. The development of more sustainable cleans for the removal of SnF2 at the interconnect level1, the Bosch-etched PERs (Post Etch residues) at the interposer level and TFRs (thick film resists) at the wafer level in advanced packaging processes will be discussed including their design concepts and performance evaluations.