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Dr. li Ma Director of advanced package, Huatian Technology (Kunshan) Electronic Co. |
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Biography Dr. li Ma received his PhD degree from Fudan university and now a director of advanced package of Huatian Technology (Kunshan) Electronic Co.. He and his R&D team have completed development for a variety of packaging technologies, such as eSinC, millimeter-wave radar chip packaging, 4G chip fanout packaging, IPD device etc. He holds more than 20 patents. Abstract Wafer-level Fan-Out (WL-FO) is a key technology and a driving force of Moore's Law, which not only provides a system scaling solution but also complements the chip scaling. The embedded silicon fan-out eSiFO® technology has combination of accuracy silicon etching, wafer re-construction and high density RDLs. The advantages include small form factor, low cost, simple process, small warpage, high yield and it is a platform technology for multi-die SiP and 3D integration. With the development of eSiFO® technology, Embedded System in Chip technology (eSinC®) was developed by Huatian Technology which has proprietary intellectual property rights. eSinc® can be used as a package technology to integrate dissimilar chips though RDLs from different functions, from different wafer and different features size into a system or a single chip by adopting wafer re-construction and TSV technology. With adoption of eSinC®, multi-chips were successfully integrated in an ultra-small silicon die to form a SiP achieving simple SMT, which has good performance and cost value. eSinC® technology has made important progress, and the samples have delivered to customer for real application. |
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