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Weihua Cheng VP/CO-CTO, YMTC |
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Biography Weihua Cheng is currently the CO-CTO of Yangtze Memory Technologies Co., Ltd. (YMTC), responsible for 3D NAND technology R&D. Before joining YMTC， he was Senior Vice President of Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC), responsible for technology R&D and manufacturing. He has more than 27 years of experience in the semiconductor industry, covering equipment, process, process integration, R&D and fab mass production management. He had participated in the 908 project and SMIC fab start up， SMIC 45nm/40nm technology development and transfer to mass production. He has a Bachelor degree in semiconductor physics and devices from ZheJiang University and a Master degree in microelectronics from National University of Singapore. Abstract 3D NAND has rapidly become a standard technology for dynamic systems. However, with array stacking layers getting higher, traditional 3D NAND flash memory faces new challenges, such as CMOS/array thermal impact and topography issues, limited I/O speed, density, and cycle times. Meanwhile, NAND fab expansion brings manufacturing challenges including efficiency loss, slow learning, material waste, and unpredictable quality. With innovative thinking and persistent efforts, YMTC provides both advanced 3D NAND solutions and smart manufacturing methods to make contribution to the industry. In this presentation, Weihua Cheng, co-CTO of YMTC will introduce how Xtacking technology solves such challenges and how to use big data analysis in smart manufacturing to meet increasing customer demands from smartphones, SSDs, and IoT applications. |
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