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日程：
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做大做强中国集成电路产业链 - 先进制造与封测
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主持人：
Dr. Yifan Guo
Vice President, ASE
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9:00-9:05
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Welcome speech
Richard Salsman
CFO and Vice President Operations, SEMI
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9:05-9:30
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Innovative 3D-SiP Package Technologies for More than Moore Era.
蓝章益
Senior Director, RD & Engineering Center, SPIL
PPT下载
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9:30-9:55
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Keynote Speech: 互利共赢 深化中国IC产业布局
雷海波
President, HLMC
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9:55-10:20
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国产处理器加速中国集成电路产业国际化进程
傅城
兆芯，VP
PPT下载
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10:20-10:45
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Heterogenous Integration and miniaturization for IC package solutions
Dr. Jim Li
Sr. Director, Central Engineering Integration, ASE
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10:45-11:10
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Assembly Development for Advanced SIP Module
徐玉鹏
VP of Engineering, ICPU of JCET
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11:10-11:35
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提升核心竞争力，做强中国集成电路产业链
许天燊
SMIC，全球市场部资深副总裁
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11:35-12:00
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Advance Package
樊俊豪
Vice president, ASM
PPT下载
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做大做强中国集成电路产业链 - 装备和材料
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主持人：
Michael Young
GM, APAC Sales, Marketing & Service, AE
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13:00-13:30
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Maximizing fab profitability through lifecycle services
Mike McDonald
Vice President, Global Service, AE
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13:30-14:00
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Keynote Speech: 高端装备国产化，小集成铸就大时代
赵晋荣
北方华创科技集团股份有限公司，总裁
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14:00-14:30
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The back-end market analysis and TEL’s activity
Mr. Kawauchi Takuo
Region Strategy Division, TEL
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14:30-15:00
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Advanced Packaging Technology & Applications
Thomas Bondur
Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research
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15:00-15:20
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Break
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15:20-15:50
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The Memory Evolution: 2D to 3D and Beyond
Er-Xuan Ping
Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc.
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15:50-16:20
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Enable IC breakthroughs with MKS Instruments surrounding chambers
Wei Shao
General Manager, MKS Instruments (Shanghai) Ltd.
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16:20-16:50
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Build cost advantage by right capital equipment purchasing strategy
商海涵
盈球半导体科技（上海）有限公司，总经理
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