做大做强中国集成电路产业链


 


 


 
     

做大做强中国集成电路产业链 - 先进制造与封测

日期: 2017年3月15日 星期三
地点: 上海浦东嘉里大酒店,浦东大宴会厅1+2+3
地址: 上海市浦东新区花木路1388号

在市场、纲要和基金的推动下,集成电路产业热度不断发酵,今后的五年里中国将会新建十多座12寸晶圆厂,中道后道封测行业亦步亦趋。做大易而做强难,中国的集成电路制造产业要如何加强核心竞争力?从技术、市场、商业模式等方方面面,如何励精图治,锐意创新,通力合作?

在线登记  上届回顾

日程:   
 
      做大做强中国集成电路产业链 - 先进制造与封测
 
主持人:
Dr. Yifan Guo
Vice President, ASE
   
9:00-9:05 Welcome speech
Richard Salsman
CFO and Vice President Operations, SEMI
   
9:05-9:30
Innovative 3D-SiP Package Technologies for More than Moore Era.
蓝章益
Senior Director, RD & Engineering Center, SPIL

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9:30-9:55
Keynote Speech: 互利共赢 深化中国IC产业布局
雷海波
President, HLMC
   
9:55-10:20
国产处理器加速中国集成电路产业国际化进程
傅城
兆芯,VP

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10:20-10:45
Heterogenous Integration and miniaturization for IC package solutions
Dr. Jim Li
Sr. Director, Central Engineering Integration, ASE
   
10:45-11:10
Assembly Development for Advanced SIP Module
徐玉鹏
VP of Engineering, ICPU of JCET
   
11:10-11:35
提升核心竞争力,做强中国集成电路产业链
许天燊
SMIC,全球市场部资深副总裁
   
11:35-12:00
Advance Package
樊俊豪
Vice president, ASM

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    做大做强中国集成电路产业链 - 装备和材料
 
主持人:
Michael Young
GM, APAC Sales, Marketing & Service, AE
   
13:00-13:30
Maximizing fab profitability through lifecycle services
Mike McDonald
Vice President, Global Service, AE
   
13:30-14:00
Keynote Speech: 高端装备国产化,小集成铸就大时代
赵晋荣
北方华创科技集团股份有限公司,总裁
   
14:00-14:30
The back-end market analysis and TEL’s activity
Mr. Kawauchi Takuo
Region Strategy Division, TEL
   
14:30-15:00
Advanced Packaging Technology & Applications
Thomas Bondur
Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research
   
15:00-15:20 Break
   
15:20-15:50
The Memory Evolution: 2D to 3D and Beyond
Er-Xuan Ping
Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc.
   
15:50-16:20
Enable IC breakthroughs with MKS Instruments surrounding chambers
Wei Shao
General Manager, MKS Instruments (Shanghai) Ltd.
   
16:20-16:50
Build cost advantage by right capital equipment purchasing strategy
商海涵
盈球半导体科技(上海)有限公司,总经理