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March 18-20, 2020
Shanghai New International Expo Centre

Memory Strategic Forum

Memory Strategic Forum

Date: Wednesday, March 18, 2020
Time: 09:00-12:00
Venue: Pudong Ballroom 4, Kerry Hotel Pudong Shanghai
Chinese and English Simultaneous Interpretation will be provided

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For Memory business, 2019 is a year of significant. According to IC Insight, capital investment will reduce 8% from $105.9 billion in 2018 to $97.8 billion in 2019. In the contrary, technology evolution is speeding up. Mainstream DRAM density goes up to 16Gb per chip on 1Znm process, SK Hynix announced 128 layers 4D NAND paired with its Periphery Under Cell (PUC) technology.

China Memory industry is forging quickly. YMTC launched production of 64 layers 3D NAND on Xtacking technology, Unigroup announced it's DRAM strategy, Innotron started the production of 8Gb DDR4.

In the era of Big Data, AI and IOT, explosive needs of low-power computing demands Memory innovations. 3D packaging, MRAM, PCRAM and RERAM move toward maturity, in-Memory computing is an emerging concept.

Let us meet again in SEMICON CHINA 2020!