Advanced Packaging Forum

Date: Sunday, June 28, 2020
Time: 13:00-16:45
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

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In the past 50 years, Moore's "law" set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As the industry approaches 7 nm sizes and smaller, the pace slows, and perhaps approaches a limit to the linear shrink. Solutions are emerging in the 3rd dimension, from "system on a chip" to "system in a package".

The final edition of ITRS was published in 2016 and then Heterogeneous Integration Roadmap was formally launched by IEEE CPMT. This transition opens on new opportunities for investment and innovation in heterogeneous integration and system level solutions.

In this year's "Advanced Packaging Forum", we will address the emerging technology of advanced packaging, heterogeneous integration, its ecosystem, and the opportunities evolving with it.

SPONSORS

       
   

Topics(not limited to):
1. HIR（Heterogeneous Integration Roadmap）
2. 3D packaging, SIP (system in a package)
3. Advanced materials and equipment
4. Advanced materials and equipment
5. Industry trends and innovations

Agenda / 议程
   
Moderator/主持人
Dr. Adam He 何新宇
Managing Director, CGP Tech Fund
盛世投资，董事总经理
   
13:00-13:10
 Opening remark/开幕致辞（Video）
Bill Bottoms
Co-Chair of HIR, Chairman of 3MTS
   
13:10-13:35
 5G环境下的微系统集成封装解决方案
Anderson Bao 包旭升
Vice President, Technical Marketing, JCET Group Co., Ltd
江苏长电科技技术市场副总裁
   
13:35-14:00
 Progress of 3D Wafer Level Packaging and Integration Technologies for 5G Applications
Dr. Daquan Yu 于大全
Distinguished Professor of Xiamen University, CEO of Xiamen Sky Semiconductor Co., Ltd.
厦门大学特聘教授，厦门云天半导体创始人
   
14:00-14:25
 Trends and challenges of chiplet packaging
Chiplet 封装的趋势和挑战
Hong Xie 谢鸿
VP, TFME Research Institute of Advanced Packaging
通富先进封装研究院副总经理
   
14:25-14:50
 The development of advanced materials for enabling packaging processes
开发引领先进半导体封装的材料
Dr. Tianniu (Rick) Chen 陳天牛
Head of Semiconductor Materials, Performance Materials division, Merck
   
14:50-15:05 Break
   
15:05-15:30
 Progress and Applications of 3D Wafer Level Packaging Technology
三维晶圆级封装技术进展和应用
Shuying.ma 马书英
President of Research Institute, Huatian technology (Kunshan) Electronics Co. LTD
华天科技(昆山)电子有限公司研究院副院长
   
15:30-15:55
 Empowered by capital, increasing opportunities for domestic semiconductors
资本助力，国产半导体新机遇
陈平
海通证券电子行业首席分析师
   
15:55-16:20
 SiP Opportunities and Challenges Driven by Multiple Applications of 5G, AI and IoT
5G，AI，IoT 多重应用需求驱动下SiP的机遇与挑战
DeWen Tian 田德文
VP, business development, Goertek Microelectronics
歌尔微电子有限公司技术与商务副总裁
   
16:20-16:30 Closing remark / 闭幕演讲
   
* The agenda and guests are subjected to adjust without notice.

Contact Us:
Hannah Zhao
Tel: 021-60278571
Email: [email protected]