Advanced Packaging Forum

Advanced Packaging Forum

Date:	Thursday, March 19, 2020
Time:	13:00-16:45
Venue:	Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration   Previous Review

A fascinating inflection point is emerging in the world of electronics. Gordon Moore's observation that semiconductor transistor density was doubling every 18 months, and with that the chip performance, proved to be quite accurate for over 50 years. Moore's "law" set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As the industry approaches 7 nm sizes and smaller, the pace slows, and perhaps approaches a limit to the linear shrink. Solutions are emerging in the 3rd dimension, from "system on a chip" to "system in a package".
The final edition of ITRS was published in 2016 and then Heterogeneous Integration Roadmap was formally launched by IEEE CPMT. This transition opens on new opportunities for investment and innovation in heterogeneous integration and system level solutions.
In this forum, we will address the emerging technology of advanced packaging, heterogeneous integration, its ecosystem, and the opportunities evolving with it.