Advanced Packaging Forum

Advanced Packaging Forum

Date:	Thursday, March 19, 2020
Time:	13:00-16:45
Venue:	Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai
	Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

In the past 50 years, Moore's "law" set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As the industry approaches 7 nm sizes and smaller, the pace slows, and perhaps approaches a limit to the linear shrink. Solutions are emerging in the 3rd dimension, from "system on a chip" to "system in a package".

The final edition of ITRS was published in 2016 and then Heterogeneous Integration Roadmap was formally launched by IEEE CPMT. This transition opens on new opportunities for investment and innovation in heterogeneous integration and system level solutions.

In this year's "Advanced Packaging Forum", we will address the emerging technology of advanced packaging, heterogeneous integration, its ecosystem, and the opportunities evolving with it.

SPONSORS


Distinguished speakers:
2020年3月19日（星期四） 13:00-16:45
•  HIR（Heterogeneous Integration Roadmap）异质整合路线图
   Bill Bottoms -- Co-Chari of HIR, Chairman of 3MTS (TBD)
•  ASE 日月光集团
•  Henkel 汉高
•  Versummaterial 慧瞻材料科技
•  Lam 泛林半导体
•  SPIL 矽品

Topics(not limited to):
1. HIR（Heterogeneous Integration Roadmap）
2. 3D packaging, SIP(system in a package)
3. Advanced materials and equipment
4. 5G packaging
5. Auto electronic packaging
6. MEMS packaging
7. Industry trends and innovations

Early bird registration is opening. Welcome to participate!
For group registration and more cooperation opportunities, please contact us:
Hannah Zhao
Tel: 021-60278571
Email: hzhao@semi.org