为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 20-22, 2019
Shanghai New International Expo Centre

Symposium V: CMP and Post-Polish Cleaning



Symposium V: CMP and Post-Polish Cleaning

Symposium Committee

Dr. Xinping Qu
Chair
Fudan University, China
   
Dr. Yuchun Wang
Co-Chair
Anji Microelectronics, China
   
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
   
Dr. Kuochun WU
Co-Chair
Cabot Microelectronics, Asia
   
Dr. Paul-Chang Lin
Member
SMIC, China
   
Dr. David P. Huang
Member
Pall Inc., USA
   
Dr. Jin-Goo PARK
Member
Hanyang University, Korea
   
Dr. Kailiang ZHANG
Member
Tanjin University of Science & Technology, China
   
Dr. Mahadevaiyer KRISHNAN
Member
IBM, USA
   
Dr. Shoutian Li
Member
Anji Microelectronics, China
   
Dr. XinChun Lu
Member
Tsinghua University , China
   
Dr. Wen-Chiang Tu
Member
Applied Materials, USA
   
Dr. Chao-Chang Arthur Chen
Member
NTUST, Taiwan, China
   

Symposium V: CMP and Post-Polish Cleaning

CMP has been an enabling technology in IC manufacturing since early 1990s, and the technology continues to play critical roles with increasing applications. Our CMP knowledge at the fundamental level often reveals refreshing insights as we approach the sub-20nm or even sub-10nm technology node in the shrinking geometry while we also stack up the IC in the 3D dimension. CSTIC CMP session (Session V) is a forum for the scientists and engineers to share all the aspects of CMP fundamentals, the latest progress in CMP equipment, CMP related materials, new CMP applications, process optimization, reliability and yield improvement. Topics include but are not limited to the following:
1. CMP fundamentals and modeling
2. Equipment and metrology for process control and defect reduction
3. Consumables including abrasive particles, slurries, pads, conditioning disks, CMP cleaning chemicals, and brushes, etc
4. CMP and post CMP cleaning process optimization in front end, middle end, back end, and various substrates such as silicon wafers and wafer reclaiming
5. Emerging applications for 3D IC’s such as FinFET, 3D NAND, hybrid bonding, TSV, MEMS, and advanced packaging