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March 20-22, 2019
Shanghai New International Expo Centre

Symposium VII: Packaging and Assembly



Symposium VII: Packaging and Assembly

Symposium Committee

Dr. Steve X. Liang
Chair
Jiangsu Changjiang Electronics Technology Co., Ltd, China
   
Dr. Yifan Guo
Co-Chair
ASE, Shanghai
   
Dr. Huili Fu
Co-Chair
HiSilicon
   
Dr. Mark Huang
Member
A-kelon (Huizhou) Optronics Ltd, China
   
Prof. Mingliang Huang
Member
Dalian University of Technology, China
   
Prof. Kuan-Neng Chen
Member
National Chiao Tung University
   
Dr. Shin-Puu Jeng
Member
Director, TSMC
   
Prof. Xing Wu
Member
East China Normal University 
   
Prof. Wenhui Zhu
Member
Central South University
   
Mr. John Rowland
Member
Spreadtrum


   
Dr. John Yuanlin Xie
Member
Altera Corp., CA, USA
   
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
   
Dr. Yishao Lai
Member
ASE, Taiwan, China
   
Dr. Jing Shi
Member
Oracle, USA
   
Dr. Young Do Kweon
Member
Samsung, Korea
   
Dr. Renzhe Zhao
Member
Huawei, China
   
Dr. Hong SHI
Member
Xilinx
   
Dr. Tim Bao
Member
Air Products and Chemicals, Inc.
   
Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
   
Dr. Daniel Lu
Member
Henkel
   
Dr. Wang Su
Member
CTO of Shanghai Sinyang Semiconductor Materials Co., Ltd., and chairman of the board of Sinyang Semiconductor (Shanghai) Technology and Innovation Co., Ltd.
   

Symposium VII: Packaging and Assembly

•  FC/MCP/die stacking/package stacking
•  Embedded active/passive integration
•  MEMS and sensor packaging technology
•  RF and microwave packaging technology
•  LED and photovoltaic packaging technology
•  Emerging technology/Nanotechnology
•  Future packaging materials
•  Interconnect
•  Thermal mechanical/electrical/thermal modeling
•  HDI/high performance interposer design and manufacturing
•  Supply chain management