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March 14-16,2018
Shanghai New International Expo Centre

Symposium VII: Packaging and Assembly



Symposium VII: Packaging and Assembly



Symposium Committee

Dr. Steve Liang
Chairman

Jiangsu Changjiang Electronics Technology Co., Ltd, China

Dr. Yifan Guo
Co-Chair

ASE, Shanghai

Dr. Huili Fu
Co-Chair

HiSilicon

Dr. Mark Huang
Member

SuZhou Speed Semiconductor, China

Prof. Mingliang Huang
Member

Dalian University of Technology, China

Prof. Kuan-Neng Chen
Member

National Chiao Tung University

Dr. Shin-Puu Jeng
Member

Director, TSMC

Prof. Xing Wu
Member

East China Normal University

Prof. Wenhui Zhu
Member

Central South University

Mr. John Rowland
Member

Spreadtrum

Dr. John Yuanlin Xie
Member

Altera Corp., San Jose, CA, USA

Dr. Roy Yu
Member

IBM, Watson Research Center, USA

Dr. Yishao Lai
Member

ASE, Taiwan, China

Dr. Jing Shi
Member

Oracle, USA

Dr. Young Do Kweon
Member

Samsung, Korea

Dr. Renzhe Zhao
Member

Huawei, China

Mr. Dan Tracy
Member

SEMI, USA

Dr. Hong SHI
Member

Xilinx

Dr. Tim Bao
Member

Air Products and Chemicals, Inc.

Dr. Tim Chen
Member

Yantai Darbond Technology Co., Ltd.

Dr. Daniel Lu
Member

Henkel


Symposium VII: Packaging and Assembly

  • 3DIC/WLSCP/TSV process and reliability

  • FC/MCP/die stacking/package stacking

  • Embedded active/passive integration

  • MEMS and sensor packaging technology

  • RF and microwave packaging technology

  • LED and photovoltaic packaging technology

  • Emerging technology/Nanotechnology

  • Future packaging materials

  • Interconnect

  • Thermal mechanical/electrical/thermal modeling

  • HDI/high performance interposer design and manufacturing

  • Thermal management/active cooling

  • Supply chain management