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March 14-16,2018
Shanghai New International Expo Centre

SIIP China: Tech Innovation and Investment Forum - China 2018

SIIP China: Tech Innovation and Investment Forum - China 2018

Date: Thursday, March 15, 2018
Venue: Pudong Ballroom 5+6+7, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

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The passing 2017 sees the escalating competition and as the Moore’s law approaching its limit, new applications such as cloud computing, big data, IoT and artificial intelligence etc. are surging. The global semiconductor industry is entering a major period of transition and change. Being the biggest integrated circuit consumer market in the world, China has been keeping a two-digit growth these years with manufacturing, design and packaging & test being the three industrial pillars. Competitions on funds, technology, products and talents have been intensifying and the strong demands have vigorously boosted the semiconductor industry.

SIIP China, SEMI Innovation Investment Platform, aims to be one of the most collaborative and influential investment platform for global semiconductor industry by leveraging SEMI global industrial resources, together with global industrial capital and intelligence. SIIP China – Tech Innovation and Investment Forum – China 2018 (TIIF 2018), is one of SIIP China’s brand activities held simultaneously with the annual SEMICON China. Besides TIIF, SIIP China series also include China Forums held in San Francisco and Munich along with SEMICON West and SEMICON Europa, respectively. SIIP China will have Delegations to overseas every year as well.

TIIF 2018 will focus on the latest policies, diagnose the current situation of the industry, analyze the capital flows and forecast the future. The AI forum will discuss how semiconductors can promote the innovations and developments of AI and how AI can bring out realistic functions as well as create more intelligent manufacturing and life by means of deep learning, big data & cloud computing, VR /AR. Semiconductor equipment and materials have been the hotspots of the industry and have drawn much the attention. At the second forum in the afternoon, we will have an overview of the investment and merge & acquisitions of this sector and also, look forward to the future for the challenges and opportunities.

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    Agenda / 会议日程:

09:00-09:30 Registration 来宾登记
   
09:30-09:35
Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
09:35-09:45
Moderator introduces Speakers 主持人介绍出席嘉宾
Liangsheng, BDA Administrative Commission Director
梁胜,北京经济技术开发区管委会主任
   
09:45-10:05
Keynote Speech 主题演讲
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
丁文武,国家集成电路投资基金总裁,中国高端芯片联盟理事长
   
10:05-10:25 Signing ceremony of MOU between SEMI China and SIIP China partners
SIIP China合作备忘录签约仪式
   
  AM Speeches 嘉宾演讲
   
10:25-10:45
Wei Shaojun
Director, Institute of Microelectronics, Tsinghua University
魏少军, 清华大学微电子学研究所所长
   
10:45-11:05
Ye Tianchun
Director, Institute of Microelectronics Chinese Academy of Sciences
叶甜春,中国科学院微电子研究所所长
   
11:05-11:25
Shen Weiguo
Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund
General Manager, Shanghai S&T Investment Co., Ltd.
沈伟国,上海集成电路产业投资基金董事长,上海科技创业投资(集团)有限公司董事总经理
   
11:25-11:45
Rick Hemond
Global Marketing, Strategy and Business Development, Dow Electronic Materials
   
11:45-13:30 Lunch break 午休
   
  PM Sessions
   
13:30-15:00 Panel Discussion 1 主题论坛1
Topic: Trends and Investment Opportunities in Artificial Intelligence
主题:人工智能领域的发展趋势及投资机遇
   
  Moderator主持人:
Wu Ping
President, Summitview Capital
武平,武岳峰资本创始合伙人
   
  Panelist嘉宾:
   
Allen Wu
EVP and President, Arm Greater China
吴雄昂,Arm大中华区全球执行副总裁兼大中华区总裁
   
Sean Ding
CTO, IoT BU, Alibaba
丁险峰,阿里云事业群-IoT事业部-技术部CTO,阿里巴巴
   
Tammy Kiely
Managing Director, Security and Investment Service, Goldman Sachs
   
Farhan Ahmad
Vice President, Credit Suisse
   
Christopher Thomas (TBD)
Managing Partner, Global Digital and Advanced Technology Strategy Practice & Asia Semiconductor Practice, McKinsey & Company, Inc.
唐睿思,麦肯锡公司全球董事合伙人,全球数字化及先进技术战略业务负责人&亚洲半导体业务负责人
   
15:00–16:30 Panel Discussion 2 主题论坛2
Topic: Semiconductor Equipment and Materials
主题:半导体设备和材料
   
  Moderator主持人:
Zhang Guoming
Senior Vice President & Chief Strategy Officer, NAURA
张国铭,北方华创科技集团服务有限公司高级副总裁&首席战略官
   
  Panelist嘉宾:
   
SHUJI DINGLEE
Global Head, Lithography Business, The Dow Chemical Company
丁术季,Global Head, Lithography Business,陶氏化学
   
Tomoyasu Cho
VP & President of KLA-Tencor China
张智安,科天副总裁兼科天中国总裁
   
Liu Xinyu
Managing Partner, CGP Techfund
刘新玉,盛世投资管理合伙人
   
Wang Hui
CEO & President, ACM Research (Shanghai), Inc.
王晖,盛美半导体设备(上海)有限公司首席执行官兼董事长
   
16:30–16:35 Thank you 致谢结束
   
Agenda is subject to change 议程变化恕不另行通知