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Agenda / 会议日程： （Tentative agenda and yet to be confirmed 详细日程有待确定）
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09:00-09:30
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Registration 来宾登记
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09:30-09:35
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Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
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09:35-09:45
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Moderator introduces Speakers 主持人介绍出席嘉宾
Liang Sheng
BDA Administrative Commission Director
梁胜，北京经济技术开发区管委会主任
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09:45-10:00
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Keynote Remarks 贵宾致辞
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
丁文武，国家集成电路投资基金总裁，中国高端芯片联盟理事长
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AM Speeches 嘉宾演讲
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10:00-10:20
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影响集成电路未来的几项技术
Wei Shaojun
Director, Institute of Microelectronics, Tsinghua University
魏少军，清华大学微电子学研究所所长
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10:20-10:40
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“产芯联动”促进半导体产业跨越发展
Shen Weiguo
Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund
General Manager, Shanghai S&T Investment Co., Ltd.
沈伟国，上海集成电路产业投资基金董事长，上海科技创业投资（集团）有限公司董事总经理
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10:40-11:00
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半导体市场展望：未决的改变
Roger Sheng
VP Analyst, Gartner Semiconductors & Electronics research group
盛陵海，研究副总裁，半导体和电子研究，Gartner
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11:00-11:20
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Impact of AI on the China Semiconductor and Electronics Ecosystem
Handel Jones
CEO, International Business Strategies, Inc.
韩徳尔•琼斯，International Business Strategies首席执行官
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11:20-11:40
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中国集成电路产业再定位
Ye Tianchun
Director, Institute of Microelectronics Chinese Academy of Sciences
叶甜春，中国科学院微电子研究所所长
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11:40-13:30
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Lunch break / 午休
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PM Sessions 下午日程
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13:30-15:00
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Panel Discussion 圆桌论坛
Topic: New Technologies and Perspectives on China Market
主题：新技术及中国市场展望
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Moderator:主持人
Charlie Chan
Executive Director, Morgan Stanley
詹家鸿，摩根士丹利证券执行董事
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Panel Discussion嘉宾：
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Charlie Chan
Executive Director, Morgan Stanley
詹家鸿，摩根士丹利证券执行董事
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Thin-film Processing Technologies for Smart Society
Koukou Suu
Senior Fellow and General Manager of Global Market & Technology Strategy, ULVAC
邹弘纲，爱发科集团全球市场和技术战略总经理
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在全球化的半导体产业竞争中胜出
Allen Lu
President & CEO, Bei Jing E-Town Semiconductor Technology Co., LTD
陆郝安，北京屹唐半导体科技有限公司总裁兼首席执行官
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Leopold Beer
VP Product Management in Automotive Electronics, Bosch
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Steve Johnston
Director, Supplier Technology and Industry Development, Global Supply Management, Intel Corporation
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15:00-16:40
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Electronics System Design Executive Session 电子系统设计高峰论坛
Topic: AI-enabled Smart Application Opportunities and IC Design Solutions
主题： AI驱动的智能应用机遇和IC设计解决方案
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Welcome remarks 欢迎致辞
Lung Chu
President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
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Opening remarks 论坛致辞
Ajit Manocha
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
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Panel Discussion
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Moderator:
Xiaoning Qi
Vice President, Alibaba Group
戚肖宁，阿里巴巴集团副总裁
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Panelists:
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AI-Enabled Smart Applications: Opportunities, Challenges and Solutions
Xiaoning Qi
Vice President, Alibaba Group
戚肖宁，阿里巴巴集团副总裁
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Approach for Domain Specific Designs & Autonomous Vehicles
Danny Perng
PacRim Vice President, Mentor, A Siemens Business
彭启煌，全球资深副总裁及亚太区总裁，明导科技
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Artificial Intelligence-The Future of Smart Chip Design
David-RJ Lin
Corporate Senior President, AsiaPac Region, Synopsys Inc.
林荣坚，全球资深副总裁及亚太区总裁，新思科技公司
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IC大市场的危与机
Eric Zhou
Marketing VP, UNISOC
周晨，北京紫光展锐科技有限公司市场部部长
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A.I. / Machine Learning: Driving Force for New Generation of EDA Innovation
Qi Wang
VP of Cadence Design Systems Inc. and the CEO of Nanjing Kaiding Electronics Technology Co. Ltd.
王琦，Cadence全球副总裁及南京凯鼎电子科技有限公司总经理
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AI-enabled Smart Applications
Opportunities and IC Design Solutions
Balachandran Rajendran
Global CTO, Semi / EDA, Unstructured Data Solutions, Dell EMC
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16:40-16:45
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Lucky Draw 幸运抽奖
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16:45-16:50
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Thank you 致谢结束
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会议议程更新中，以会议现场资料为准。
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