China Memory Strategic Forum

Date: Friday, March 16, 2018
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

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Gartner just released a rough estimate in 2017 for top 10 semiconductor manufacturing company; Samsung surpassed Intel whom was the top candidate for a long time in the industry. Memory takes one third revenue in whole industry incomes with simultaneously rising of volume and price which 17% rising in NAND and 44% in DRAM. Driven by market needs and policy support, 3 new Chinese Memory Companies are speeding up in process development. How shall the multi-national enterprises share the growth of China Memory market? How shall the new players enhance the R&D, and cooperate with global players? Industrial leaders will join the forum to share the insights.

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     Agenda / 日程：

12:30-13:00 Registration
   
Moderator
Andrew Peng
CSO and Vice President of Business Development, Tong Fu Microeletronics Co., Ltd;
Deputy to JEDEC Chairman
   
13:05-13:30
Memory Packaging Trends: An Era of Change
E. Jan Vardaman
President of TechSearch International, Inc.
   
13:30-13:55
 Unleashing MRAM as Persistent Memory
Mustafa Pinarbasi
CTO and Sr. Vice President of Magnetics Technology Spin Transfer Technologies
   
13:55-14:20
Overcoming Manufacturing Challenges for Memory Technologies
Harmeet Singh
Corporate Vice President, Lam Research
   
14:20-14:45
 Equipment and Process Technologies Enabling Advanced Memory Devices
Kaitsuka Takanobu
Director of CTM Device Technology Project Department of TEL
   
14:45-15:10
Advanced Memory Packaging Roadmap and OSAT Implications
Scott Sikorski
Vice President of Group Technology Strategy & Product Technology Roadmap for JCET Group
   
15:10-15:35
Specialty Memory Market：Build up Eco-system to keep growing
Zhiqiang Su
Marketing strategic director, GigaDevice Semiconductor Inc.
   
15:35-15:55
The Development Trend and Breakdown Analysis of Global DRAM Industry in 2018
Ken Kuo
Research Vice President, DRAMeXchange
   
Agenda is subject to change 议程变化恕不另行通知