为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
English
March 14-16,2018
Shanghai New International Expo Centre

Build China's IC Ecosystem - Equipment and Material

Build China's IC Ecosystem


 


 


 
     

Build China's IC Ecosystem - Equipment and Material

Date: Wednesday, March 15, 2017
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Sharpen the saw to win! Equipment and Material are the fundamental to Semiconductor industry, but we are still in the very low level today for its supply. Come to the forum to share the learning on Market, on technical challenges and we are confident to make the significant progress if we work together!

Attendee Registration  Previous Review

Agenda:   
   
    Build China's IC Ecosystem - Advanced Manufacturing,Assembly & Test
   
Moderator:
Dr. Yifan Guo
Vice President, ASE
   
9:00-9:05 Welcome speech
Richard Salsman
CFO and Vice President Operations, SEMI
   
9:05-9:30
Innovative 3D-SiP Package Technologies for More than Moore Era.
Albert Lan
Senior Director, RD & Engineering Center, SPIL
PPT Download
   
9:30-9:55
Keynote Speech: 互利共赢 深化中国IC产业布局
Haibo Lei
President, HLMC
   
9:55-10:20
Domestic CPU accelerates the internationalization process of China IC industry
Frank Fu
VP, 兆芯

PPT Download
   
10:20-10:45
Heterogenous Integration and miniaturization for IC package solutions
Dr. Jim Li
Sr. Director, Central Engineering Integration, ASE
   
10:45-11:10
Assembly Development for Advanced SIP Module
Yupeng Xu
VP of Engineering, ICPU of JCET

PPT Download
   
11:10-11:35
Strengthening China’s IC Ecosystem with Core Competitiveness
Sunny Hui
Senior Vice President of Marketing, SMIC
   
11:35-12:00
Advance Package
Fan Chun Ho
Vice president, ASM

PPT Download
   
   
   Build China's IC Ecosystem - Equipment and Material
   
Moderator:
Michael Young
GM, APAC Sales, Marketing & Service, AE
   
13:00-13:30
Maximizing fab profitability through lifecycle services
Mike McDonald
Vice President, Global Service, AE
   
13:30-14:00
Keynote Speech: 高端装备国产化,小集成铸就大时代
Jinrong Zhao
President, NAURA
   
14:00-14:30
The back-end market analysis and TEL’s activity
Mr. Kawauchi Takuo
Region Strategy Division, TEL
   
14:30-15:00
Advanced Packaging Technology & Applications
Thomas Bondur
Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research
   
15:00-15:20 Break
   
15:20-15:50
The Memory Evolution: 2D to 3D and Beyond
Er-Xuan Ping
Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc.
   
15:50-16:20
Enable IC breakthroughs with MKS Instruments surrounding chambers
Wei Shao
General Manager, MKS Instruments (Shanghai) Ltd.
   
16:20-16:50
Build cost advantage by right capital equipment purchasing strategy
Jonathan Shang
General Manager, SurplusGLOBAL China, Inc., SurplusGLOBAL